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Resin Technology Group 451 Oxy-Bond™ Electrically Conductive Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive , Epoxy, Electrically Conductive
Manufacturer Resin Technology Group
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Resin Technology Group 451 Oxy-Bond™ Electrically Conductive Epoxy Adhesive.pdf
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Material Notes:
Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to match a variety of specific application parameters, including MIL-APPROVED. Custom designed bonding products and expert technical assistance are always available.Resin Technology Group 451 Oxy-Bond™ Electrically Conductive Epoxy Adhesive and SealantOne component, silver conductive bonder/sealant.
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 150 °C
302 °F
Minimum Service Temperature, Air -60.0 °C
-76.0 °F
Processing Properties Metric English Comments
Cure Time 10.0 min

@Temperature 120 °C
0.167 hour

@Temperature 248 °F
Pot Life >= 20160 min
>= 20160 min
>= 20160 min
>= 20160 min
Descriptive Properties Value Comments
Viscosity Smooth Paste
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