Polymer Property : CTE, linear = 33.0 Âµm/m-Â°C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	33.0 Âµm/m-Â°C	18.3 Âµin/in-Â°F	DIN 53752
Lehmann & Voss LUVOCOMÂ® 1100/GF/30/NAT Polyether sulfone, with glass fiber Applications: Apparatus- and precision engineering, film- and photo industry, sporting- and leisure goods, medical- and electrical enineering, aircraft- and aerospace industry.High dimensionally sta..
CTE, linear	33.0 Âµm/m-Â°C	18.3 Âµin/in-Â°F	ASTM D696
Samyang TrirexÂ® 3025G15 Polycarbonate, 15% Glass Reinforced TRIREXÂ® polycarbonate resins offer superior transparency, mechanical properties, good dimensional stability and high electrical performance, which allows it to be widely used for electrical, elec..
CTE, linear	33.0 Âµm/m-Â°C	18.3 Âµin/in-Â°F	ASTM D696
Samyang TrirexÂ® 3025GNH15 Polycarbonate, Reinforced Flame Retardancy, Non-Halogen PC is characterized by its excellent impact resistance, dimensional stability and excellent thermal resistance.3025GNH15 is a reinforced, flame retardant, non-halogen grade.Applications: LCD Panel ..
CTE, linear	33.0 µm/m-°C @Temperature 20.0 °C	18.3 µin/in-°F @Temperature 68.0 °F
Tra-Con Tra-Bond 2126 Black Opaque Epoxy Adhesive TRA-BOND 2126 is recommended for those modern photographic, industrial, and laboratory bonding and laminating applications where an easy-to-use, black (opaque) epoxy adhesive system with high perfor..
CTE, linear	33.0 µm/m-°C	18.3 µin/in-°F	Below Tg
Tra-Con Tra-Bond 342-14T Low Viscosity Room Temperature Cure Epoxy Adhesive TRA-BOND 342-14T single component, low viscosity alumina-filled epoxy adhesive exhibits high bond strength and excellent thermal shock characteristics. This adhesive may be cured at room temperature..
CTE, linear	33.0 µm/m-°C @Temperature 20.0 °C	18.3 µin/in-°F @Temperature 68.0 °F
Tra-Con Tra-Bond F156 Optically Opaque Epoxy Adhesive TRA-BOND F156 is a black, solvent-free thixotropic epoxy system recommended for high quality photographic industry bonding, laminating, production and repair applications where a room-temperature cu..
CTE, linear	33.0 µm/m-°C @Temperature 50.0 - 200 °C	18.3 µin/in-°F @Temperature 122 - 392 °F	DIN 53 752
Ensinger TECASINT 5051 Polyimide, 30% Glass Fiber Filled (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel..
CTE, linear	33.0 µm/m-°C @Temperature -50.0 - 50.0 °C	18.3 µin/in-°F @Temperature -58.0 - 122 °F
Abatron AboWeld 8708-5 One-Component Structural/Dielectric Epoxy AboWeld 8708-5 is a highly filled, class H (180°C) structural, heat-conductive adhesive paste for SLOW high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating;..
CTE, linear	33.0 µm/m-°C @Temperature -50.0 - 50.0 °C	18.3 µin/in-°F @Temperature -58.0 - 122 °F
Abatron AboWeld 8708-7 One-Component Structural/Dielectric Epoxy AboWeld 8708-7 is a highly filled, class H (180°C) structural, heat-conductive adhesive paste for FASTER high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulatin..
CTE, linear	33.0 µm/m-°C @Temperature -50.0 - 50.0 °C	18.3 µin/in-°F @Temperature -58.0 - 122 °F
Abatron AboWeld 8708-8 One-Component Structural/Dielectric Epoxy AboWeld 8708-8 is a highly filled, class H (180°C) structural, heat-conductive adhesive paste for FAST high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating;..
CTE, linear	33.0 µm/m-°C @Temperature 20.0 °C	18.3 µin/in-°F @Temperature 68.0 °F
Armstrong C-1/A Epoxy Adhesive A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor..
CTE, linear	33.0 µm/m-°C @Temperature 20.0 °C	18.3 µin/in-°F @Temperature 68.0 °F
Armstrong C-7/W Epoxy Adhesive, 3:2 Mix Ratio A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may ..