Processing Properties | Metric | English | Comments |
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Processing Temperature | 160 - 302 °C | 320 - 576 °F | Injection |
Dyna-Purge® B Purging Compound Designed for Injection and Extrusion Blow MoldingGeneral Description:DYNA-PURGE B is a non-abrasive, non-chemical “engineered†thermoplastic purging compound, formulated to flow naturally .. |
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Processing Temperature | 160 - 302 °C | 320 - 576 °F | Extrusion |
Dyna-Purge® B Purging Compound Designed for Injection and Extrusion Blow MoldingGeneral Description:DYNA-PURGE B is a non-abrasive, non-chemical “engineered†thermoplastic purging compound, formulated to flow naturally .. |
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Processing Temperature | 160 - 302 °C | 320 - 576 °F | Injection |
Dyna-Purge® P Purging Compound Designed for Hot Runner SystemsGeneral Description:DYNA-PURGE P is a non-abrasive, non-chemical “engineered†thermoplastic purging compound, formulated to have a natural flow through the b.. |
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Processing Temperature | 160 - 302 °C | 320 - 576 °F | Extrusion |
Dyna-Purge® SF Purging Compound Designed for Sheet & Profile Co-Extrusion & Multi-Layer FilmGeneral Description:DYNA-PURGE SF is a non-abrasive, non-chemical “engineered†thermoplastic purging compound, with a proprietar.. |
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Processing Temperature | 160 - 302 °C | 320 - 576 °F | Extrusion |
Dyna-Purge® X Purging Compound Designed for Sheet & Profile ExtrusionGeneral Description:DYNA-PURGE X is a non-abrasive, non-chemical “engineered†thermoplastic purging compound, formulated to have a natural flow throug.. |