| Category | Polymer , Adhesive , Thermoset , Polyurethane, TS , Thermoset Polyurethane, Adhesive |
| Manufacturer | Aptek Laboratories |
| Trade Name | |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Aptek 2120 PMF Low modulus urethane staking compound.pdf |
| Price | EMAIL US sales@lookpolymers.com |
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 0.980 g/cc | 0.0354 lb/in³ | ASTM D1475 |
| Viscosity | 188000 cP | 188000 cP | ASTM D1824 |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore A | 63 | 63 | Cured property; ASTM D2240 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | -60.0 °C | -76.0 °F | Cured property; JMTP P-200 |
| Flash Point | >= 150 °C | >= 302 °F | ASTM D92 |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 1.00e+15 ohm-cm | 1.00e+15 ohm-cm | Cured property; ASTM D257 |
| Dielectric Constant | 3.5 @Frequency 1000 Hz |
3.5 @Frequency 1000 Hz |
Cured property; ASTM D150 |
| Dielectric Strength | >= 13.8 kV/mm @Thickness 0.127 mm |
>= 350 kV/in @Thickness 0.00500 in |
Cured; ASTM D149 |
| Dissipation Factor | 0.024 @Frequency 1000 Hz |
0.024 @Frequency 1000 Hz |
Cured property; ASTM D150 |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Processing Temperature | 85.0 °C | 185 °F | Cure 5 hrs |
| 100 °C | 212 °F | Cure 3 hrs | |
| 125 °C | 257 °F | Cure 1.5 hrs |