Arlon AD600 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards

Category	Polymer , Thermoplastic , Fluoropolymer , PTFE
Manufacturer	Arlon
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Arlon AD600 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Ceramic Filled High Dielectric ConstantMechanically Robust; replaces brittle laminates that cannot withstand processing, impact or High G forcesLarge Panel SizesHigh Peel Strength for Narrow LinesBenefits:Circuit MiniaturizationReplace Ceramic in Some ApplicationsImproved Processing and ReliabilityLarge Panel Sizes for Multiple Circuit Layout and lower cost ProcessingTypical Applications:Microwave Combiner and Power Divider BoardsPower Amplifiers, Filters and CouplersSmaller Footprint AntennasDigital Audio Broadcasting (DAB) Antennas (Satellite Radio)GPS & Hand-held RFID Reader AntennasAntennas in Hand-held RFID ReadersInformation provided by Arlon Materials for Electronics (MED).

Physical Properties	Metric	English	Comments
Density	2.45 g/cc	0.0885 lb/in³	ASTM D792 Method A
Outgassing - Total Mass Loss	0.00 % @Pressure <=1.33e-10 MPa, Temperature 125 °C	0.00 % @Pressure <=1.93e-8 psi, Temperature 257 °F	Water Vapor Recovered; NASA SP-R-0022A
	0.010 % @Pressure <=1.33e-10 MPa, Temperature 125 °C	0.010 % @Pressure <=1.93e-8 psi, Temperature 257 °F	Collected Volatiles; NASA SP-R-0022A
	0.020 % @Pressure <=1.33e-10 MPa, Temperature 125 °C	0.020 % @Pressure <=1.93e-8 psi, Temperature 257 °F	NASA SP-R-0022A

Mechanical Properties	Metric	English	Comments
Peel Strength	2.10 kN/m	12.0 pli	After Thermal Stress; IPC TM-650 2.4.8

Thermal Properties	Metric	English	Comments
CTE, linear	10.0 µm/m-°C @Temperature 0.000 - 100 °C	5.56 µin/in-°F @Temperature 32.0 - 212 °F	y direction; IPC TM-650 2.4.24
	11.0 µm/m-°C @Temperature 0.000 - 100 °C	6.11 µin/in-°F @Temperature 32.0 - 212 °F	x direction; IPC TM-650 2.4.24
CTE, linear, Transverse to Flow	45.0 µm/m-°C @Temperature 0.000 - 100 °C	25.0 µin/in-°F @Temperature 32.0 - 212 °F	z direction; IPC TM-650 2.4.24
Thermal Conductivity	0.460 W/m-K @Temperature 100 °C	3.19 BTU-in/hr-ft²-°F @Temperature 212 °F	ASTM E1225
Flammability, UL94	V-0	V-0	Vertical Burn

Electrical Properties	Metric	English	Comments
Dielectric Constant	5.5 @Thickness 0.140 mm	5.5 @Thickness 0.00550 in
	6.3 @Thickness 3.81 mm	6.3 @Thickness 0.150 in
	6.15 @Thickness 0.381 mm, Frequency 1.00e+6 Hz	6.15 @Thickness 0.0150 in, Frequency 1.00e+6 Hz	C23/50; IPC TM-650 2.5.5.3
Dissipation Factor	0.0030 @Frequency 1.00e+6 Hz	0.0030 @Frequency 1.00e+6 Hz	C23/50; IPC TM-650 2.5.5.3
Arc Resistance	>= 180 sec	>= 180 sec	D48/50; ASTM D495

Users viewing this material also viewed the following: