| Category | Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive |
| Manufacturer | Devcon |
| Trade Name | |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Devcon Fastmeal™ Epoxy.pdf |
| Price | EMAIL US sales@lookpolymers.com |
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.61 g/cc | 0.0581 lb/in³ |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 90 | 90 | ASTM D2240 |
| Tensile Strength, Ultimate | 21.68 MPa | 3145 psi | ASTM D638 |
| Modulus of Elasticity | 5.86 GPa | 850 ksi | In Tension; ASTM D638 |
| Flexural Yield Strength | 53.1 MPa | 7700 psi | ASTM D790 |
| Compressive Yield Strength | 87.6 MPa | 12700 psi | ASTM D695 |
| Adhesive Bond Strength | 13.8 MPa | 2000 psi | Adhesive tensile shear strength; ASTM D1002 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 58.0 µm/m-°C @Temperature 20.0 °C |
32.2 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Thermal Conductivity | 0.854 W/m-K | 5.91 BTU-in/hr-ft²-°F | ASTM C177 |
| Maximum Service Temperature, Air | 121 °C | 250 °F | Operating Temperature |
| Shrinkage | 0.93 % | 0.93 % | During Cure; ASTM D2566 |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Dielectric Constant | 18.6 | 18.6 | ASTM D150 |
| Dielectric Strength | 14.6 kV/mm | 370 kV/in | ASTM D149 |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Processing Temperature | >= 4.44 °C | >= 40.0 °F | |
| Pot Life | 4.00 min @Temperature 23.9 °C |
4.00 min @Temperature 75.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Coverage per lb. | 69 in² | at 1/4 inch thick |
| Mix Ratio by Volume | 1 to 1 | resin:hardener |
| Mix Ratio By Weight | 1 to 1 | resin:hardener |