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Loctite® 3166 Deep Potting Epoxy

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced , Epoxy, Thermally Conductive
Manufacturer	Loctite
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Loctite® 3166 Deep Potting Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

PottersLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies.For electronics assembly, Loctite offers deep potting, high adhesion, non-corrosive, and thermally conductive potting products. These can be cured with heat, UV light, or moisture.Loctite® 3166 Deep Potting EpoxyA heat cure soft epoxy for deep potting applications that require low shrinkage, thermal stability and environmental resistance. Cure Type: Heat Bonding Type: 2 part epoxy

Physical Properties	Metric	English	Comments
Viscosity	1800 cP	1800 cP	Mixed

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	15	15
Hardness, Shore OO	64	64

Thermal Properties	Metric	English	Comments
CTE, linear	70.0 µm/m-°C @Temperature 20.0 °C	38.9 µin/in-°F @Temperature 68.0 °F
Glass Transition Temp, Tg	-27.0 °C	-16.6 °F

Processing Properties	Metric	English	Comments
Cure Time	180 min @Temperature 80.0 °C	3.00 hour @Temperature 176 °F
Pot Life	30.0 min @Temperature 80.0 °C	30.0 min @Temperature 176 °F
Gel Time	90.0 min	90.0 min	at 80°C

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