| Category | Metal , Electronic/Magnetic Alloy , Nonferrous Metal , Precious Metal , Palladium Alloy , Silver Alloy |
| Manufacturer | Williams Advanced Alloys |
| Trade Name | |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Williams Advanced Alloys C103 Solder.pdf |
| Price | EMAIL US sales@lookpolymers.com |
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 11.8 g/cc | 0.426 lb/in³ |
| Component Elements Properties | Metric | English | Comments |
|---|---|---|---|
| Copper, Cu | 14 % | 14 % | |
| Gold, Au | 10 % | 10 % | |
| Palladium, Pd | 35 % | 35 % | |
| Platinum, Pt | 10 % | 10 % | |
| Silver, Ag | 30 % | 30 % | |
| Zinc, Zn | 1.0 % | 1.0 % |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Electrical Resistivity | 0.0000313 - 0.0000352 ohm-cm | 0.0000313 - 0.0000352 ohm-cm |
| Descriptive Properties | Value | Comments |
|---|---|---|
| ASTM Equiv. | B540 | |
| Compare To: | Paliney 7 | |
| Tempers Available | AR,A,WQ |