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Polymer Property : Particle Size = 20 µm Product List

Physical Properties

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Physical Properties Metric English Comments
Particle Size <= 20 µm
<= 20 µm
99% finer
Malvern Minerals Novacite® Daper Untreated Lamellar Quartz Filler/Extender
Novacite® quartz silica has closely controlled sizing that is used extensively in the coatings field. Novacite® has broad acceptance as silica in special purpose, product finishes OEM, automo..
Particle Size 20 µm
20 µm
99% finer than
Imerys Amlockâ„¢ 321 Kaolin
Information provided by Imerys
Particle Size 20 µm
20 µm
99% finer than
Imerys Bardenâ„¢ Kaolin
Barden is a high surface area kaolin product used a filler in rubber and plastic applications.Information provided by Imerys
Particle Size 20 µm
20 µm
99.5% finer than
Imerys Barnetâ„¢ Kaolin
Information provided by Imerys
Particle Size 20 µm
20 µm
Average Size
Inhance Fluoro-Seal INHANCE® HD-1800 HDPE
Product Description: INHANCE HD-1000 Series Polyethylene Particles are surface-activated High Density Polyethylene (HDPE) in particle or powder form. Surface activation makes the particles easy to..
Particle Size 20 µm
20 µm
maximum of 15% less than
H.C. Starck Amperit® 586.1 Chromium Carbide-Nickel Chromium 80-20 (Cr3C2-NiCr)
Particle Size 20 µm
20 µm
50% of particles
Ferro CF 7574 Glaze and Sealant Glass
Glass Type: Zn-B-Si Typical Powder Form: VSD Typical Application: Pyrex Silicon Ferro's electronic and specialty glass group has produced over 3,000 formulations. Many are used as protective and ..
Particle Size 20 µm
20 µm
Silberline SilBerCote® 520-10Z
SilBerCote® Z polymer treated aluminum pigments are resistant to acid and alkali staining, while providing enhanced electrical charge resistance in finished coatings. Product is typically formula..
Particle Size 20 µm
20 µm
Silberline Silvar "A"
Silvar A is a standard grade; class "C", coarse leafing aluminum pigment carried in mineral spirits.Applications: Trade & Maintenance
Particle Size 20 µm
20 µm
Silberline Sparkle Silvex® Premier 890-20-D
Sparkle Silvex® D grades are aluminum pigment flakes dampened with a plasticizer to help prevent the individual flakes from becoming airborne during handling and processing. They are well suited ..
Particle Size 20 µm
20 µm
Springback 13%, pressure 0.477 t/cc
TIMCAL TIMREX® KS150 Primary Synthetic Graphite
TIMREX Primary Synthetic Graphite is produced in a unique highly controlled graphitization process which assures narrow specifications and unequalled consistent quality due to: monitoring of all pro..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® 353ND-T Black High Temperature Thixotropic Epoxy
Product Description: EPO-TEK® 353ND-T Black is a two component, high temperature, thixotropic epoxy for fiber optic, PCB and various medical applications. Advantages & Application Notes: This produ..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® EE165-3 Silver Filled Epoxy
A two component, silver-filled, electrically conductive epoxy made for bonding of SMDs, and general solder replacement at the PCB level and circuit assembly. It was designed to be low modulus and f..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® H37-MP Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H37-MP is a single component, electrically conductive, thixotropic silver-filled adhesive for die-attach and SMD attach inside hybrid microelectronic packages. Also av..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® H54 High Temperature Epoxy
Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optica..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® OE121 Black Epoxy Adhesive
Material Description: A two component, low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. ..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® OE138 Two Component Epoxy
Material Description: A two component epoxy with intermediate viscosity range between EPO-TEK® 353ND and EPO-TEK® 353ND-T. It is designed for semiconductor glob top applications, as well as use in..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide
Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® H37-MPT Epoxy
Material Description: A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certi..
Particle Size 20 µm
20 µm
@ 98%
CIMBAR RiverCal™ 8103 & 8103C Calcium Carbonate (CaCO3)
RiverCal™ 8100 Series Calcium Carbonate are high purity, white, functional fillers targeted for use in thermosets, thermoplastics, paint & coatings, sealants, TPO's and TPE's and other applications..
Particle Size 20 µm
20 µm
10th%
3M S32 Glass Bubbles
3M™ Glass Bubbles are engineered hollow glass microspheres that are alternatives to conventional fillers and additives such as silicas, calcium carbonate, talc, clay, etc., for many demanding appli..
Particle Size 20 µm
20 µm
10th%
3M S35 Glass Bubbles
3M™ Glass Bubbles are engineered hollow glass microspheres that are alternatives to conventional fillers and additives such as silicas, calcium carbonate, talc, clay, etc., for many demanding appli..
Particle Size 20 µm
20 µm
10th%
3M S22 Glass Bubbles
3M™ Glass Bubbles are engineered hollow glass microspheres that are alternatives to conventional fillers and additives such as silicas, calcium carbonate, talc, clay, etc., for many demanding appli..
Particle Size 20 - 24 µm
20 - 24 µm
10%
H.C. Starck Amperit® 584.1 Chromium Carbide-Nickel Chromium 75-25 (Cr3C2-NiCr)
Particle Size <= 20 µm
<= 20 µm
D90
Potters Industries A-Series Z-CEL® 8054 White Synthetic Sodium Aluminosilicate Microsphere
Fine particle white spheres developed as filler for paints, coatings and films.Information provided by Potters Industries.
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