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Polymer Property : Particle Size = 20 µm Product List

Physical Properties

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Physical Properties Metric English Comments
Particle Size 20 µm
20 µm
97% finer than
Imerys Diamondâ„¢ Kaolin
Diamond is an intermediate-grained montmorillonitc kaolin used primarily in plastic formed bodies. This kaolin is known for its good strength and white-firing characteristics.Information provided by..
Particle Size 20 µm
20 µm
96% finer than
Imerys Kaolin Slurryâ„¢
Kaolin Slurry is a carefully controlled Kaolin-water suspension formulated for use in cermic castings.Information provided by Imerys
Particle Size 20 µm
20 µm
99% finer than
Imerys Mercapâ„¢ 100 Kaolin
Information provided by Imerys
Particle Size <= 20 µm
<= 20 µm
90% less than
H.C. Starck Grade A Zirconium Carbide, ZrC
Additive for hard metalsAdditive for powder metallurgyModerator in solid fuel propellant
Particle Size <= 20 µm
<= 20 µm
50
Solvay Chemicals Ixper® 60C Calcium Peroxide
IXPER® 60C is a Calcium Peroxide powder used in a wide range of applications in environmental, seed coating, baking e.g. marketsEINECS Number: 215-139-4/CAS Number: 1305-79-9Information provided ..
Particle Size <= 20 µm
<= 20 µm
>50
Solvay Chemicals Ixper® 75C Calcium Peroxide
IXPER® 75C is a Calcium Peroxide powder used in a wide range of applications in environmental, seed coating, baking and oil drilling e.g. marketsEINECS Number: 215-139-4/CAS Number: 1305-79-9Info..
Particle Size 20 µm
20 µm
Silberline SilBerCote® 303-20Z
SilBerCote® Z polymer treated aluminum pigments are resistant to acid and alkali staining, while providing enhanced electrical charge resistance in finished coatings. Product is typically formula..
Particle Size 20 µm
20 µm
Silberline SilBerCote® PC 6222X
SilBerCote® PC X can be formulated into post-blend and bonded metallic powder coatings. The inorganic surface treatment on the flake imparts improved chemical and environmental resistance propert..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® 353ND-T4 Thixotropic Epoxy
Product Description: EPO-TEK® 353ND-T4 is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. This is a higher viscosity version of EPO-TEK® 353..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® 730 General Purpose Epoxy
Product Description: EPO-TEK® 730 is a two component, thixotropic, room temperature-curing epoxy adhesive. Advantages & Application Notes: Excellent all purpose adhesive. Many uses in job shop and ..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® 731 Epoxy Adhesive
Material Description: A two component, thixotropic, room temperature-curing epoxy adhesive. It is an electrically and thermally insulating epoxy designed for general applications in semiconductor p..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® E3001-6 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® ED1021 Epoxy
Preliminary Product Information SheetMaterial Description: A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Unique features include its abil..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® OE121 Black Epoxy Adhesive
Material Description: A two component, low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. ..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide
Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl..
Particle Size 20 µm
20 µm
Target Median Particle Size
CIMBAR Crescent 35 Calcium Carbonate (CaCO3), Medium Powder
CIMBAR's Crescent product line is a natural calcium carbonate ground to various particle size distributions. The crystalline structure of the calcium carbonate in Crescent products has a predominan..
Particle Size 20 µm
20 µm
Median Grain Diameter
Nabaltec APYRAL® 2E Al(OH)3
APYRAL ® from Nabaltec is an environmentally friendly halogen free product which is used as a flame retardant filler in a wide variety of rubber and polymeric materials. During thermal decompositio..
Particle Size 20 µm
20 µm
10th%
3M D32/4500 Glass Bubbles
3M™ Glass Bubbles are engineered hollow glass microspheres that are alternatives to conventional fillers and additives such as silicas, calcium carbonate, talc, clay, etc., for many demanding appli..
Particle Size <= 20 µm
<= 20 µm
Average; Internal Method
Solvay Specialty Polymers Algoflon® L100 Polytetrafluoroethylene (PTFE)  (Unverified Data**)
Algoflon® L100 is a white PTFE micropowder comprising loose agglomerates of sub-micron sized particles. Algoflon® L100 is specially polymerized to obtain a powder with exceptionally high specific ..
Particle Size <= 20 µm
<= 20 µm
D90
Potters Industries A-Series Z-CEL® 8054 White Synthetic Sodium Aluminosilicate Microsphere
Fine particle white spheres developed as filler for paints, coatings and films.Information provided by Potters Industries.
Particle Size <= 20 µm
<= 20 µm
3rd Streak; Fineness of Grind
Gwent Electronic Materials C2030304D2 Aluminum Ink
C2030304D2 is designed as a screen printing ink for termination of Barium Titanate based PTC devices.This Ink is in a ready to use form at a viscosity suitable for automatic or semiautomatic screen ..
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