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- Polymer Property : Particle Size = 20 µm
Polymer Property : Particle Size = 20 µm Product List
Physical PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Particle Size | 20 µm | 20 µm | 97% finer than |
| Imerys Diamondâ„¢ Kaolin Diamond is an intermediate-grained montmorillonitc kaolin used primarily in plastic formed bodies. This kaolin is known for its good strength and white-firing characteristics.Information provided by.. |
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| Particle Size | 20 µm | 20 µm | 96% finer than |
| Imerys Kaolin Slurryâ„¢ Kaolin Slurry is a carefully controlled Kaolin-water suspension formulated for use in cermic castings.Information provided by Imerys |
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| Particle Size | 20 µm | 20 µm | 99% finer than |
| Imerys Mercapâ„¢ 100 Kaolin Information provided by Imerys |
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| Particle Size | <= 20 µm | <= 20 µm | 90% less than |
| H.C. Starck Grade A Zirconium Carbide, ZrC Additive for hard metalsAdditive for powder metallurgyModerator in solid fuel propellant |
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| Particle Size | <= 20 µm | <= 20 µm | 50 |
| Solvay Chemicals Ixper® 60C Calcium Peroxide IXPER® 60C is a Calcium Peroxide powder used in a wide range of applications in environmental, seed coating, baking e.g. marketsEINECS Number: 215-139-4/CAS Number: 1305-79-9Information provided .. |
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| Particle Size | <= 20 µm | <= 20 µm | >50 |
| Solvay Chemicals Ixper® 75C Calcium Peroxide IXPER® 75C is a Calcium Peroxide powder used in a wide range of applications in environmental, seed coating, baking and oil drilling e.g. marketsEINECS Number: 215-139-4/CAS Number: 1305-79-9Info.. |
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| Particle Size | 20 µm | 20 µm | |
| Silberline SilBerCote® 303-20Z SilBerCote® Z polymer treated aluminum pigments are resistant to acid and alkali staining, while providing enhanced electrical charge resistance in finished coatings. Product is typically formula.. |
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| Particle Size | 20 µm | 20 µm | |
| Silberline SilBerCote® PC 6222X SilBerCote® PC X can be formulated into post-blend and bonded metallic powder coatings. The inorganic surface treatment on the flake imparts improved chemical and environmental resistance propert.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® 353ND-T4 Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T4 is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. This is a higher viscosity version of EPO-TEK® 353.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® 730 General Purpose Epoxy Product Description: EPO-TEK® 730 is a two component, thixotropic, room temperature-curing epoxy adhesive. Advantages & Application Notes: Excellent all purpose adhesive. Many uses in job shop and .. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® 731 Epoxy Adhesive Material Description: A two component, thixotropic, room temperature-curing epoxy adhesive. It is an electrically and thermally insulating epoxy designed for general applications in semiconductor p.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® E3001-6 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® ED1021 Epoxy Preliminary Product Information SheetMaterial Description: A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Unique features include its abil.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® OE121 Black Epoxy Adhesive Material Description: A two component, low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. .. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl.. |
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| Particle Size | 20 µm | 20 µm | Target Median Particle Size |
| CIMBAR Crescent 35 Calcium Carbonate (CaCO3), Medium Powder CIMBAR's Crescent product line is a natural calcium carbonate ground to various particle size distributions. The crystalline structure of the calcium carbonate in Crescent products has a predominan.. |
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| Particle Size | 20 µm | 20 µm | Median Grain Diameter |
| Nabaltec APYRAL® 2E Al(OH)3 APYRAL ® from Nabaltec is an environmentally friendly halogen free product which is used as a flame retardant filler in a wide variety of rubber and polymeric materials. During thermal decompositio.. |
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| Particle Size | 20 µm | 20 µm | 10th% |
| 3M D32/4500 Glass Bubbles 3M™ Glass Bubbles are engineered hollow glass microspheres that are alternatives to conventional fillers and additives such as silicas, calcium carbonate, talc, clay, etc., for many demanding appli.. |
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| Particle Size | <= 20 µm | <= 20 µm | Average; Internal Method |
| Solvay Specialty Polymers Algoflon® L100 Polytetrafluoroethylene (PTFE)
(Unverified Data**) Algoflon® L100 is a white PTFE micropowder comprising loose agglomerates of sub-micron sized particles. Algoflon® L100 is specially polymerized to obtain a powder with exceptionally high specific .. |
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| Particle Size | <= 20 µm | <= 20 µm | D90 |
| Potters Industries A-Series Z-CEL® 8054 White Synthetic Sodium Aluminosilicate Microsphere Fine particle white spheres developed as filler for paints, coatings and films.Information provided by Potters Industries. |
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| Particle Size | <= 20 µm | <= 20 µm | 3rd Streak; Fineness of Grind |
| Gwent Electronic Materials C2030304D2 Aluminum Ink C2030304D2 is designed as a screen printing ink for termination of Barium Titanate based PTC devices.This Ink is in a ready to use form at a viscosity suitable for automatic or semiautomatic screen .. |
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