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Polymer Property : Particle Size = 20 µm Product List
Physical PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Particle Size | <= 20 µm | <= 20 µm | 99% finer |
| Malvern Minerals Novacite® Daper Untreated Lamellar Quartz Filler/Extender Novacite® quartz silica has closely controlled sizing that is used extensively in the coatings field. Novacite® has broad acceptance as silica in special purpose, product finishes OEM, automo.. |
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| Particle Size | 20 µm | 20 µm | 99% finer than |
| Imerys Amlockâ„¢ 321 Kaolin Information provided by Imerys |
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| Particle Size | 20 µm | 20 µm | 99% finer than |
| Imerys Bardenâ„¢ Kaolin Barden is a high surface area kaolin product used a filler in rubber and plastic applications.Information provided by Imerys |
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| Particle Size | 20 µm | 20 µm | 99.5% finer than |
| Imerys Barnetâ„¢ Kaolin Information provided by Imerys |
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| Particle Size | 20 µm | 20 µm | Average Size |
| Inhance Fluoro-Seal INHANCE® HD-1800 HDPE Product Description: INHANCE HD-1000 Series Polyethylene Particles are surface-activated High Density Polyethylene (HDPE) in particle or powder form. Surface activation makes the particles easy to.. |
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| Particle Size | 20 µm | 20 µm | maximum of 15% less than |
| H.C. Starck Amperit® 586.1 Chromium Carbide-Nickel Chromium 80-20 (Cr3C2-NiCr) |
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| Particle Size | 20 µm | 20 µm | 50% of particles |
| Ferro CF 7574 Glaze and Sealant Glass Glass Type: Zn-B-Si Typical Powder Form: VSD Typical Application: Pyrex Silicon Ferro's electronic and specialty glass group has produced over 3,000 formulations. Many are used as protective and .. |
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| Particle Size | 20 µm | 20 µm | |
| Silberline SilBerCote® 520-10Z SilBerCote® Z polymer treated aluminum pigments are resistant to acid and alkali staining, while providing enhanced electrical charge resistance in finished coatings. Product is typically formula.. |
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| Particle Size | 20 µm | 20 µm | |
| Silberline Silvar "A" Silvar A is a standard grade; class "C", coarse leafing aluminum pigment carried in mineral spirits.Applications: Trade & Maintenance |
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| Particle Size | 20 µm | 20 µm | |
| Silberline Sparkle Silvex® Premier 890-20-D Sparkle Silvex® D grades are aluminum pigment flakes dampened with a plasticizer to help prevent the individual flakes from becoming airborne during handling and processing. They are well suited .. |
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| Particle Size | 20 µm | 20 µm | Springback 13%, pressure 0.477 t/cc |
| TIMCAL TIMREX® KS150 Primary Synthetic Graphite TIMREX Primary Synthetic Graphite is produced in a unique highly controlled graphitization process which assures narrow specifications and unequalled consistent quality due to: monitoring of all pro.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® 353ND-T Black High Temperature Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T Black is a two component, high temperature, thixotropic epoxy for fiber optic, PCB and various medical applications. Advantages & Application Notes: This produ.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® EE165-3 Silver Filled Epoxy A two component, silver-filled, electrically conductive epoxy made for bonding of SMDs, and general solder replacement at the PCB level and circuit assembly. It was designed to be low modulus and f.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® H37-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H37-MP is a single component, electrically conductive, thixotropic silver-filled adhesive for die-attach and SMD attach inside hybrid microelectronic packages. Also av.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® H54 High Temperature Epoxy Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optica.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® OE121 Black Epoxy Adhesive Material Description: A two component, low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. .. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® OE138 Two Component Epoxy Material Description: A two component epoxy with intermediate viscosity range between EPO-TEK® 353ND and EPO-TEK® 353ND-T. It is designed for semiconductor glob top applications, as well as use in.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® H37-MPT Epoxy Material Description: A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certi.. |
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| Particle Size | 20 µm | 20 µm | @ 98% |
| CIMBAR RiverCal™ 8103 & 8103C Calcium Carbonate (CaCO3) RiverCal™ 8100 Series Calcium Carbonate are high purity, white, functional fillers targeted for use in thermosets, thermoplastics, paint & coatings, sealants, TPO's and TPE's and other applications.. |
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| Particle Size | 20 µm | 20 µm | 10th% |
| 3M S32 Glass Bubbles 3M™ Glass Bubbles are engineered hollow glass microspheres that are alternatives to conventional fillers and additives such as silicas, calcium carbonate, talc, clay, etc., for many demanding appli.. |
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| Particle Size | 20 µm | 20 µm | 10th% |
| 3M S35 Glass Bubbles 3M™ Glass Bubbles are engineered hollow glass microspheres that are alternatives to conventional fillers and additives such as silicas, calcium carbonate, talc, clay, etc., for many demanding appli.. |
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| Particle Size | 20 µm | 20 µm | 10th% |
| 3M S22 Glass Bubbles 3M™ Glass Bubbles are engineered hollow glass microspheres that are alternatives to conventional fillers and additives such as silicas, calcium carbonate, talc, clay, etc., for many demanding appli.. |
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| Particle Size | 20 - 24 µm | 20 - 24 µm | 10% |
| H.C. Starck Amperit® 584.1 Chromium Carbide-Nickel Chromium 75-25 (Cr3C2-NiCr) |
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| Particle Size | <= 20 µm | <= 20 µm | D90 |
| Potters Industries A-Series Z-CEL® 8054 White Synthetic Sodium Aluminosilicate Microsphere Fine particle white spheres developed as filler for paints, coatings and films.Information provided by Potters Industries. |
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