Polymer Property : Spiral Flow = 23.2 in Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Spiral Flow	59.0 - 83.0 cm	23.2 - 32.7 in	177°C/1000 psi
Cookson Group Plaskon® 3400FP Epoxy Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs ..