Polymer Property : Viscosity = 45000 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	25000 - 45000 cP @Temperature 25.0 °C	25000 - 45000 cP @Temperature 77.0 °F
Nanocyl EPOCYL™ NC E128-04 Master Batch Liquid Bisphenol-A Resin for Solvent Based Formulation Purposes EPOCYL™ NC E128-04 is a Mater Batch based on liquid Bisphenol-A (Bis-A) epoxy resin containing high concentration of Carbon Nanotubes (CNT) produced by Nanocyl. It is specifically developed for so..
Viscosity	25000 - 45000 cP @Temperature 25.0 °C	25000 - 45000 cP @Temperature 77.0 °F
Nanocyl EPOCYL™ NC R128-04 Master Batch Liquid Bisphenol-A Resin for Solvent Based Formulation Purposes: Dilution Factor 6 EPOCYL™ NC R128-04 is a Master Batch based on liquid Bisphenol-A (Bis-A) epoxy resin containing high concentration of Carbon Nanotubes (CNT) produced by Nanocyl, with a suggested dilution factor of..
Viscosity	25000 - 45000 cP	25000 - 45000 cP
Master Bond MasterSil 708FR One Part, Flame Resistant Silicone Description: MasterSil 708FR is a one component, high performance RTV silicone that is mainly used for its flame retardancy. It is UL listed with a flame classification for 94V.1 for thicknesses of ..
Viscosity	35000 - 45000 cP	35000 - 45000 cP
Master Bond UV10TK40 UV Curable Compound Has Gap Filling Properties Description: Master Bond UV10TK40 is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties, chemical resistance and high gl..
Viscosity	35000 - 45000 cP	35000 - 45000 cP
Master Bond UV10TKMed One component UV curable, biocompatible, high viscosity compound Product Description: Master Bond UV10TKMed is a higher viscosity, one part UV system for bonding, sealing and coating that passes USP Class VI testing along with ISO 10993-5 for cytotoxicity. It has..
Viscosity	30000 - 45000 cP	30000 - 45000 cP	Part B
Master Bond EP21FRNS-2 Two Component, Flame Resistant Epoxy System Master Bond Polymer System EP21FRNS-2 is a two component, room temperature curing, flame retardant compound for potting, encapsulating and casting. Particularly noteworthy are its low smoke generati..
Viscosity	35000 - 45000 cP @Temperature 23.0 °C	35000 - 45000 cP @Temperature 73.4 °F
Master Bond EP30HT High Temperature Resistant Two Component Epoxy System Master Bond Polymer Adhesive EP30HT is a medium viscosity, two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, w..
Viscosity	25000 - 45000 cP @Temperature 23.0 °C	25000 - 45000 cP @Temperature 73.4 °F	1 rpm
Epoxy Technology EPO-TEK® EJ2189-LV Electrically Conductive Epoxy Low Viscosity, two component room temp curing conductive epoxyInformation Provided by Epoxy Technology
Viscosity	600 - 45000 cP @Temperature 165 - 175 °C	600 - 45000 cP @Temperature 329 - 347 °F	Average value: 6480 cP Grade Count:48
Overview of materials for Epoxy Molding Compound This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Molding Compound". Each property range of values reported is minimum and maximum values of appropr..
Viscosity	35000 - 45000 cP	35000 - 45000 cP
Master Bond UV15X-6NONMED-2 Abrasion Resistant UV Curable Compound Description: Master Bond Polymer System UV15X-6NONMED-2 is a newly developed one component clear, non-yellowing, UV curable urethane elastomer system possessing high flexibility and abrasion resista..