Polymer Property : Viscosity = 819200 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	>= 819200 cP @Temperature 23.0 °C	>= 819200 cP @Temperature 73.4 °F	0.5 rpm
Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding...
Viscosity	>= 819200 cP @Temperature 23.0 °C	>= 819200 cP @Temperature 73.4 °F	0.5 rpm
Epoxy Technology EPO-TEK® H44 Gold-Filled, Electrically Conductive Epoxy Product Description: EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.Advantages & Application Notes: High visco..