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Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy.pdf
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Material Notes:
A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. Higher viscosity version of EPO-TEK® 430.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 1.02 g/cc
1.02 g/cc
Part B
3.79 g/cc
3.79 g/cc
Part A
Particle Size <= 50 µm
<= 50 µm
Viscosity >= 819200 cP

@Temperature 23.0 °C
>= 819200 cP

@Temperature 73.4 °F
0.5 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 77
77
Tensile Modulus 2.75 GPa
400 ksi
Storage
Shear Strength 8.20 MPa
1190 psi
Die
9.267 MPa
1344 psi
Lap
Thermal Properties Metric English Comments
CTE, linear 57.0 µm/m-°C
31.7 µin/in-°F
Below Tg
Thermal Conductivity 1.55 W/m-K
10.8 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 250 °C
482 °F
Continuous
350 °C
662 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 110 °C
>= 230 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 434 °C
813 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity >= 0.0050 ohm-cm
>= 0.0050 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 25 ppm
25 ppm
Ionic Impurities - K (Potassium) 3.0 ppm
3.0 ppm
Ionic Impurities - Cl (Chloride) 15 ppm
15 ppm
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 80.0 °C
0.500 hour

@Temperature 176 °F
60.0 min

@Temperature 60.0 °C
1.00 hour

@Temperature 140 °F
Pot Life 180 min
180 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Amber
Part B
Brown Copper
Part A
Consistency Thick paste
Ionic Impurities NH4 36 ppm
Mix Ratio By Weight 100:2
Number of Components Two
Weight Loss 0.76%
200°C
1.65%
250°C
2.8%
300°C
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