Physical Properties | Metric | English | Comments |
---|---|---|---|
Thickness | 0.890 - 1.25 microns | 0.0350 - 0.0492 mil | 2000-4000 rpm |
Dow SiLK™ I 1070 Semiconductor Dielectric Resin SiLK™ I 1070 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 1070 is compatible wi.. |