Polymer Property : Brookfield Viscosity = 11580 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Brookfield Viscosity	3460 - 11580 cP	3460 - 11580 cP	Spindle 14 @ 10rpm
Lord Adhesives Thermosetâ„¢ ME-455-1 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ ME-455-1 encapsulant is a low viscosity, one-component, semiconductor grade epoxy designed for the encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavi..