Physical Properties | Metric | English | Comments |
---|---|---|---|
Brookfield Viscosity | 3460 - 11580 cP | 3460 - 11580 cP | Spindle 14 @ 10rpm |
Lord Adhesives Thermosetâ„¢ ME-455-1 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ ME-455-1 encapsulant is a low viscosity, one-component, semiconductor grade epoxy designed for the encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavi.. |