Physical Properties | Metric | English | Comments |
---|---|---|---|
Brookfield Viscosity | 190000 - 240000 cP @Temperature 25.0 °C |
190000 - 240000 cP @Temperature 77.0 °F |
HBT, Spindle #SC4-14 @ 10rpm |
Lord Adhesives Metech 3610 Gold Alloy Conductor Composition Gold alloy conductor composition 3610 is a mixed bond composition designed for microcircuit applications requiring aluminum wire bonds. It offers excellent aged wire bond adhesion for both aluminum .. |
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Brookfield Viscosity | 190000 - 240000 cP @Temperature 25.0 °C |
190000 - 240000 cP @Temperature 77.0 °F |
HBT, Spindle #SC4-14 @ 10rpm |
Lord Adhesives Metech 3612 Gold Conductor Composition Gold conductor composition 3612 is a mixed bond conductor designed for use in chip and wire bonding applications and for use in manufacturing multilayer interconnection circuitry. The composition fi.. |
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Brookfield Viscosity | 190000 - 240000 cP @Temperature 25.0 °C |
190000 - 240000 cP @Temperature 77.0 °F |
HBT, Spindle #SC4-14 @ 10rpm |
Lord Adhesives Metech 3615 Platinum Gold Conductor Composition Platinum gold conductor composition 3615 is a mixed bond conductor designed for military, aerospace, and other high reliability applications that require soldered connections. This composition is de.. |