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Lord Adhesives Metech 3610 Gold Alloy Conductor Composition

Category Polymer , Adhesive
Manufacturer Lord Adhesives
Trade Name Metech
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Lord Adhesives Metech 3610 Gold Alloy Conductor Composition.pdf
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Material Notes:
Gold alloy conductor composition 3610 is a mixed bond composition designed for microcircuit applications requiring aluminum wire bonds. It offers excellent aged wire bond adhesion for both aluminum and gold wires. The composition fires at 850°C to a dense, pin-hole free film with a typical fired thickness of 9-11 microns. The vehicle system permits resolution of 125 micron lines and spaces.All information provided by Lord.
Physical Properties Metric English Comments
Brookfield Viscosity 190000 - 240000 cP

@Temperature 25.0 °C
190000 - 240000 cP

@Temperature 77.0 °F
HBT, Spindle #SC4-14 @ 10rpm
Thickness 9.00 - 11.0 microns
0.354 - 0.433 mil
Fired
Electrical Properties Metric English Comments
Surface Resistivity per Square <= 0.0040 ohm
<= 0.0040 ohm
Processing Properties Metric English Comments
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Coverage (cm²/gm) 50-60
Calculated from 50 micron wet film
Line Resolution (microns) 125
Wire Bond Strength (grams) 13-15
Ultrasonic Aluminum, Initial
7-9
Ultrasonic Aluminum, Aged (300ºC for 1 hour)
8-10
Thermosonic Gold, Aged (300ºC for 1 hour)
9-11
Thermosonic Gold, Initial
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