Mechanical Properties | Metric | English | Comments |
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Compressive Strength | 128 MPa | 18500 psi | Ultimate; TM R050-38 |
Resinlab® EP1112NC Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1112NC Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Clear is a modified version of the standard EP11.. |
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Compressive Strength | 128 MPa | 18500 psi | Ultimate; TM R050-38 |
Resinlab® EP1112NC Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1112NC Black is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Black is a modified version of the standard EP11.. |
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Compressive Strength | 128 MPa | 18600 psi | Parallel |
Momentive Performance Materials BNC2 Boron Nitride (BN) Refractory Composite Boron Nitride is a unique engineering material. It is a soft, machinable ceramic which can be combined with other refractory ceramics including Aluminum Oxide, Silicon Nitride, Aluminum Nitride, Mu.. |
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Compressive Strength | 128 MPa | 18600 psi | ASTM D695 |
Plenco 5118 Phenolic, Granular, Injection Molded PLENCO 05118 is a mineral and graphite filled phenolic molding compound, formulated for bearing seals. 05118 provides for a low coefficient of friction, abrasion resistance, minimal water absorptio.. |
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Compressive Strength | 128 MPa @Temperature 23.0 °C |
18600 psi @Temperature 73.4 °F |
EN ISO 604 |
Ensinger TECASINT™ 2032 Polyimide, Black, 40% Graphite (PI) TECASINT™ 2000 series of polyimide stock shapes provide a superior combination of high temperature and bearing and wear, properties that make it an ideal choice for the most demanding applications... |
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Compressive Strength | 128 - 156 MPa | 18600 - 22600 psi | |
Bulk Molding Compounds BMC T15(GP) General Purpose Molding Compound BMC T15(GP) is a high strength, low shrink general purpose molding compound. Due to the excellent flow and controlled reactivity, BMC T15(GP) is well suited for a variety of applications. It is av.. |