Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Adhesive Bond Strength | 39.3 MPa | 5700 psi | Cured property; Die Shear for Ag to Si, 0.07" x 0.07" IC |
Aptek 6500-PMF Electrically conductive epoxy adhesive High purity, low outgassing, electrically conductive adhesiveAPTEK 6500-PMF is a one component, pre-mixed frozen, 100% solid, silver-filled epoxy adhesive specifically designed for microelectronic d.. |