Polymer Property : Adhesive Bond Strength = 600 psi Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Adhesive Bond Strength	4.14 - 4.83 MPa	600 - 700 psi
Sika Industry SikaTack UltraFast Fast Cure One Part Polyurethane Adhesive Sika UltraFast SikaTack Fast Cure One Part Polyurethane AdhesiveThis revolutionary product uses heat instead of moisture to "pre-cure" the adhesive. The product is heated before applications using a..
Adhesive Bond Strength	4.14 MPa	600 psi	Polystyrene-Polystyrene; Substrate Failure; Tensile Lap Shear
Master Bond MB306 Low Viscosity Methyl Cyanoacrylate Features superior bonding properties. Master Bond MB306 is a single component, low viscosity, rapid setting, methyl cyanoacrylate adhesive. Similar to other types of “super glue”, MB306 cures ver..
Adhesive Bond Strength	4.14 MPa	600 psi	Lap shear, alum to alum
Tra-Con Tra-Bond 240-2 Polyurethane Adhesive TRA-BOND 240-2 polyurethane adhesive is a low outgassing polyurethane adhesive which meets the requirements of NASA specification SP-R-0022. Information provided by Tra-Con Inc.
Adhesive Bond Strength	4.14 MPa	600 psi	Lap shear, adhesion to glass
Tra-Con Tra-Bond 9392 Flexible Potting Epoxy Adhesive TRA-BOND 9392 is a low viscosity, two-part polyurethane formulation recommended for potting and molding where flexibility and temperature resistance are required. TRA-BOND 9349 is a room temperature..
Adhesive Bond Strength	4.14 MPa	600 psi	Lap shear, alum to alum, 24 hrs @ 25°C
Tra-Con Tra-Cast 3110 Low Density Epoxy Casting System TRA-CAST 3110 is a unicellular, low density, syntactic-foam epoxy resin casting system of medium viscosity that easily handles, mixes and cures at room temperature. Developed for industrial encapsul..
Adhesive Bond Strength	>= 4.14 MPa	>= 600 psi	Aluminum to Aluminum
Loctite® 3882 Flexible Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..
Adhesive Bond Strength	4.14 MPa	600 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® SEC1233 Silver Filled Epoxy Adhesive Resinlab™ SEC1233 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1233 provides excellent electrical conductivit..
Adhesive Bond Strength	4.14 MPa	600 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1046FG Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1046FG Black is a two part unfilled very fast curing electronic grade epoxy encapsulant designed for small castings (less than 25 grams). It cures very quickly with low exotherm to a to..
Adhesive Bond Strength	4.14 MPa	600 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1046FG Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1046FG Clear is a two part unfilled very fast curing electronic grade epoxy encapsulant designed for small castings (less than 25 grams). It cures very quickly with low exotherm to a to..