Polymer Property : Compressive Modulus = 0.0758 GPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Compressive Modulus	0.0758 GPa	11.0 ksi	Stabilized, typ
Hexcel® HexWeb® HRH-10 - 3/8 - 2.0 Aramid Fiber/Phenolic Resin Honeycomb Designation: Material-Cell Size-Density.Hexweb HRH-10 is manufactured from NOMEX aramid fiber sheets. A thermosetting adhesive is used to bond these sheets at the nodes, and after expanding to the h..
Compressive Modulus	0.0758 GPa	11.0 ksi	Stabilized, typ
Hexcel® HexWeb® HRH-10 - 1/4 - 2.0 Aramid Fiber/Phenolic Resin Honeycomb Designation: Material-Cell Size-Density.Hexweb HRH-10 is manufactured from NOMEX aramid fiber sheets. A thermosetting adhesive is used to bond these sheets at the nodes, and after expanding to the h..
Compressive Modulus	0.0758 GPa	11.0 ksi	Stabilized, typ
Hexcel® HexWeb® HRH-10 - 3/16 - 2.0 Aramid Fiber/Phenolic Resin Honeycomb Designation: Material-Cell Size-Density.Hexweb HRH-10 is manufactured from NOMEX aramid fiber sheets. A thermosetting adhesive is used to bond these sheets at the nodes, and after expanding to the h..
Compressive Modulus	0.0758 GPa	11.0 ksi	TM R050-38
Resinlab® SEC1233 Silver Filled Epoxy Adhesive Resinlab™ SEC1233 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1233 provides excellent electrical conductivit..