Polymer Property : Compressive Modulus = 2.36 GPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Compressive Modulus	2.36 GPa	342 ksi	ASTM D695
Quadrant EPP Techtron® HPV PPS (ASTM Product Data Sheet)
Compressive Modulus	2.36 GPa	343 ksi
Trelleborg AEM Syntac® Eccolite® Ultra Eccolite® Ultra is a new generation syntactic foam plug assist material, a new thermoplastic compound developed in response to the needs of the thermoforming industry. Eccolite® is tough and robus..
Compressive Modulus	2.36 GPa @Temperature 23.0 °C	342 ksi @Temperature 73.4 °F	EN ISO 604
Ensinger TECASINT 4011 Polyimide, Yellow (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel..
Compressive Modulus	2.36 GPa @Temperature 23.0 °C	342 ksi @Temperature 73.4 °F	EN ISO 604
Ensinger TECASINT 4201 SD Polyimide, Black, Carbon Fiber (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel..
Compressive Modulus	2.36 GPa	342 ksi	ASTM D695
Arlon CuClad 250 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate CuClad 250 uses a higher fiberglass/PTFE ratio to provide mechanical properties approaching those of conventional substrates. Better dimensional stability and lower thermal expansion in all directi..
Compressive Modulus	2.36 GPa	342 ksi	ASTM-D-695
BCC Products EB 6200 Epoxy Tooling Board EB6200 is a “grain-free” elevated temperature epoxy modeling material known for its superior surface finish, dimensional stability and the ability to maintain tolerances even after being subjected..