Polymer Property : Compressive Modulus = 5.52 GPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Compressive Modulus	5.52 GPa	800 ksi	ASTM D695
Quadrant EPP Techtron® PSBG PPS, Polyphenylene sulfide, bearing grade, compression molded (ASTM Product Data Sheet)
Compressive Modulus	5.52 GPa	800 ksi	TM R050-38
Resinlab® EP1330 Heat Cure Epoxy Polymer System Resinlab™ EP1330 and EP1330LV are one part heat cure epoxy polymer systems. They can also be used as a small mass potting or staking compounds, or a dam adhesive in and “dam and fill” application..