Resinlab® EP1330 Heat Cure Epoxy Polymer System

Resinlab™ EP1330 and EP1330LV are one part heat cure epoxy polymer systems. They can also be used as a small mass potting or staking compounds, or a dam adhesive in and “dam and fill” application, or general polymer systems where the application requires high thermal conductivity, low shrinkage, low CTE and excellent adhesion to a wide variety of plastics, metals and circuit board materials. EP1330 is a thixotropic adhesive with slight sag upon curing, EP1330LV is a semi-free flowing material which will self level, but still maintain a conformal build on circuit board components.Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.