Polymer Property : Tensile Modulus = 250 ksi Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Tensile Modulus	1.72 GPa	250 ksi	ASTM D638
Quadrant EPP Fluorosint® 207 PTFE, Compression Molded Synthetic Mica-filled PTFE (ASTM Product Data Sheet)
Tensile Modulus	1.72 GPa	250 ksi	ASTM D638
Quantum PVDF Information provided by Quantum Advanced Engineering Plastics
Tensile Modulus	1.72 GPa	250 ksi	TM R050-36
Resinlab® EP965LVLX Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..
Tensile Modulus	1.72 GPa	250 ksi	ASTM D638
FiberfilÂ® PP-61/VO/NH Polypropylene Copolymer, Flame Retardant, non-halogenated, UL94 V0 Information provided by FIBERFIL Engineered Plastics
Tensile Modulus	1.72 GPa	250 ksi
Saint-Gobain RulonÂ® II Bearing/Seal PTFE An injection moldable bearing material that possesses excellent chemical and wear resistance. Rulon II is available in injection molded finished parts only. Excellent friction and wear properties al..
Tensile Modulus	1.72 GPa	250 ksi	ASTM D 638
Styrolution Zylar 960 MBS ZYLAR 960 is an impact modified styrene acrylic copolymer that provides toughness equivalent to some grades of polycarbonate, good clarity and superior processing characteristics for demanding injec..
Tensile Modulus	>= 1.72 GPa @Temperature 23.9 °C	>= 250 ksi @Temperature 75.0 °F
Master Bond UV15LV One Component, UV Curable Epoxy Based System Product Description: Master Bond UV15LV is a high strength, low viscosity, epoxy based UV curable system for bonding, sealing and coating. It has low viscosity and it is widely used in a variety of ..
Tensile Modulus	1.72 GPa	250 ksi	ASTM D882
Westlake Plastics PVDF Film Made from KYNAR® Polyvinylidene Fluoride Resin Excellent chemical resistance. Stable to UV and the effects of weather. Low NBS smoke generation and superior LOI. Excellent transmittance of solar energy. Excellent dielectric strength. High h..
Tensile Modulus	1.72 GPa	250 ksi	ASTM D638
Total PSI 935E Polystyrene Polystyrene 935E is a high impact polystyrene exhibiting exceptional toughness for sheet and thermoforming applications.This polymer is an excellent choice for cups, food packaging, custom sheet and..
Tensile Modulus	1.72 GPa @Temperature -20.0 °C	250 ksi @Temperature -4.00 °F	DAM; Dynamic; ISO 11403-1 -2
DuPont Performance Polymers Zytel® 330 NC010 Nylon (Unverified Data**) Unreinforced PolyamideZytel 330 NC010 is a transparent polyamide resin with amorphous characteristics.Information provided by DuPont Performance Polymers
Tensile Modulus	1.72 GPa	250 ksi	ASTM D638
Americas Styrenics STYRON A-TECH® 1400AS High Impact Polystyrene Product CharacteristicsHigh FlowGood ImpactFood Contact CompliantTypical ApplicationsTelevision housingsPrinter HousingsConsumer goodsInformation provided by AmericasStyrenics LLC.
Tensile Modulus	1.72 GPa	250 ksi	ASTM D638
Total PSI 975E Polystyrene Polystyrene 975E is a high impact polystyrene designed for extrusion/thermoforming applications. The food ESCR properties of 975E dictate its use for dairy applications that are subjected to high bu..
Tensile Modulus	1.72 GPa	250 ksi	TM R050-36
Resinlab® EP965LVLX Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..
Tensile Modulus	1.72 GPa	250 ksi	ASTM D638
ExxonMobil Paxon™ AG45-004 Blow Molding Resin (discontinued **) AG45-004 is a blow molding high density polyethylene which offers exceptional stress crack resistance and impact performance. It contains an antistat which permits this resin to be used in all food..
Tensile Modulus	1.72 - 2.07 GPa	250 - 300 ksi
Master Bond EP30M4LV Chemically Resistant, Low Viscosity Adhesive Description: Master Bond EP30M4LV is a two component, low viscosity epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weig..