Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Tensile Modulus | 1.57 GPa @Temperature 149 °C |
228 ksi @Temperature 300 °F |
|
Master Bond EP112 Low Viscosity Heat Curing Cycloaliphatic Epoxy Adhesive Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical & e.. |