Thermal Properties | Metric | English | Comments |
---|---|---|---|
Glass Transition Temp, Tg | 172 °C | 342 °F | TMA; ASTM D3850 |
Rogers Corporation XT/duroid™ 8100 0.002" Woven Glass Reinforced Thermoplastic Circuit Material XT/duroid™ 8100 woven glass reinforced thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. XT/duroid 81.. |
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Glass Transition Temp, Tg | 172 °C | 342 °F | Dry |
Hexcel® HexPly® F593 Epoxy Resin HexPly® F593 is a modified 350°F (177°C) curing epoxy system with very low flow for carbon fabric and tape applications that provides excellent laminate and honeycomb sandwich properties. As a lo.. |