Polymer Property : Glass Transition Temp, Tg = 30.0 °C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Glass Transition Temp, Tg	30.0 °C	86.0 °F	DSC; ASTM E1356-03
NeXolve White Optionox® Polyimide Film Highly UV durable with excellent weatherability and stability to ozone.Optinox® films and coatings are highly UV durable and exhibit excellent weathering durability, including very high stability ..
Glass Transition Temp, Tg	30.0 Â°C	86.0 Â°F
Mallard Creek Polymers ROVENEÂ® 6014 Acrylic Emulsion Applications: RoveneÂ® 6014 is a self crosslinking acrylic polymer providing a stiff hand to frothed or saturated substrates. RoveneÂ® 6014 is recommended for various nonwoven and paper applicat..
Glass Transition Temp, Tg	30.0 Â°C	86.0 Â°F
Mallard Creek Polymers RoveneÂ® 6117 Acrylic Emulsion Applications: RoveneÂ® 6117 is a clear drying, 100% acrylic, water resistant latex emulsion designed to provide protection for all types of concrete, cementitious and rigid surfaces. RoveneÂ® 61..
Glass Transition Temp, Tg	30.0 °C	86.0 °F
Lubrizol Estane® UB601 Thermoplastic Polyurethane Type: Estane® UB601 resin is a linear, hydroxyl terminated polyurethane polymer designed to be used as a binder for ink formulations. For ink applications, it gives high hardness to coated surface..
Glass Transition Temp, Tg	30.0 °C	86.0 °F
Master Bond FLM36 B-staged film for high performance bonding and sealing Master Bond FLM36 is a film adhesive with exceptional strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. Based on the Master ..
Glass Transition Temp, Tg	30.0 °C	86.0 °F
Master Bond X17MED Elastomer Compound for Medical Device Applications Description: Master Bond Polymer System X17MED is a specially formulated one component adhesive specially designed for bonding polyolefins such as polypropylene and polyethylene as well as their man..
Glass Transition Temp, Tg	30.0 °C	86.0 °F
Master Bond EP36AN One Part, Toughened, B-Stage Epoxy Description: Master Bond EP36AN is a unique one component, high performance epoxy for bonding, encapsulation, potting and coating featuring thermal conductivity, electrical insulation and high tempe..
Glass Transition Temp, Tg	30.0 °C	86.0 °F
Trelleborg Emerson & Cuming Stycast® 2850FT-FR/11 Two-Component Epoxy Flame Retardant Encapsulant Features and Typical ApplicationsProvide flame resistance down to 1/8 of an inch. These products also offer various other features such as thermal shock protection, low viscosity, and thermal conduc..
Glass Transition Temp, Tg	30.0 °C	86.0 °F
Loctite® Durabond® E-40FL Epoxy Adhesive Epoxy AdhesivesLoctite offers a complete line of one-part and two-part epoxy and urethane adhesives for structural bonding, potting and encapsulating. The Loctite® Durabond® line contains 14 appli..
Glass Transition Temp, Tg	<= 30.0 °C	<= 86.0 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® 310M-2 Optically Clear, Flexible Epoxy Material Description: A two component, optically clear, flexible epoxy adhesive designed for optical applications within semiconductor, fiber optic and medical industries. An alternative to EPO-TEK..
Glass Transition Temp, Tg	>= 30.0 °C	>= 86.0 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® E2036 Epoxy Product Description: A two component, slightly flexible, silver-filled, electrically conductive adhesive for semiconductor and electronic assemblies. It is a low Tg epoxy, intended for many kinds o..
Glass Transition Temp, Tg	>= 30.0 °C	>= 86.0 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® EJ2189 Electrically Conductive Epoxy Product Description: EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although othe..
Glass Transition Temp, Tg	30.0 °C	86.0 °F	DAM; 10°C/min; ISO 11357-1/-2
DuPont Performance Polymers Zytel® RS LC2800 NC010 Nylon (Unverified Data**) Plasticized Renewably Sourced Polyamide Developed for Extrusion Information provided by DuPont Performance Polymers
Glass Transition Temp, Tg	30.0 °C	86.0 °F	TM R050-25
Resinlab® EP1282 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1282 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat..