Polymer Property : Glass Transition Temp, Tg = 331 °F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Glass Transition Temp, Tg	166 °C	331 °F	Resin, Wet, Cured at 450°F
Renegade Materials Corporation RM-5001 Cyanate Ester Prepreg, 3K 8HS Fabric RM-5001 cyanate ester is a very low outgassing, toughened, high performance prepreg. Straightforward 350°F Cure Designed for the unique requirements of satellite and missile structuresLow shrinka..
Glass Transition Temp, Tg	166 °C	331 °F	Resin, Wet, Cured at 450°F
Renegade Materials Corporation RM-5001 Cyanate Ester Prepreg, 6781 S2 Glass Fabric RM-5001 cyanate ester is a very low outgassing, toughened, high performance prepreg. Straightforward 350°F Cure Designed for the unique requirements of satellite and missile structuresLow shrinka..
Glass Transition Temp, Tg	166 °C	331 °F	Prepreg, Measured from Storage Modulus, Wet
Renegade Materials Corporation RM-5003 Cyanate Ester Prepreg 4581 Quartz Fabric Low dielectric and loss, high performance prepreg. 350°F Cure Developed with consistent handling and superior performance Designed for demanding electrical, radome and antennae applications Del..
Glass Transition Temp, Tg	166 °C	331 °F
Cookson Group Plaskon® LS-16S Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress molding compound specifically formulated for use with conventional molding equipment to increase semiconductor manuf..
Glass Transition Temp, Tg	166 °C	331 °F
Cookson Group Plaskon® ULS-12HLG Epoxy Encapsulant (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A state-of-the-art, ultra low stress epoxy encapsulant designed for packaging large, stress-sensitive DIPs, PLCCs and QFPs. It i..
Glass Transition Temp, Tg	166 °C	331 °F	TMA; IPC TM-650 2.4.24
Arlon 51N Lead-Free Compatible Epoxy Low-Flow 51N is a non-DICY multifunctional epoxy low-flow prepreg system designed to provide high reliability through lead-free solder operations. The high decomposition temperature and high thermal stabili..