Thermal Properties | Metric | English | Comments |
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Glass Transition Temp, Tg | 205 °C | 401 °F | DMA (Tan d Peak); IPC-TM-650.2.4.24.3 |
Park Electrochemical Nelco® N5000-30/32 BT Epoxy Package The Nelco N5000-30 prepreg and N5000-32 laminate BT epoxy materials are designed specifically to meet or exceed new and emerging chippackaging requirements. The primary applications of these materia.. |
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Glass Transition Temp, Tg | 205 °C | 401 °F | DSC; IPC TM-650 2.4.25 |
Arlon MULTICLAD™ HF Halogen-Free Low-Loss Laminate and Prepreg System MULTICLAD™ HF represents the next generation low-loss thermoset and prepreg system for high-speed and high-frequency printed circuit boards. This technology combines a low-loss, high reliability t.. |