Arlon MULTICLAD™ HF Halogen-Free Low-Loss Laminate and Prepreg System

MULTICLAD™ HF represents the next generation low-loss thermoset and prepreg system for high-speed and high-frequency printed circuit boards. This technology combines a low-loss, high reliability thermoset resin system with non-brominated flame retardant system to create a material that is great in terms of electrical performance, durability and cost.First generation environmentally friendly laminate system with competitive Insertion Loss and Loss Tangent (Df < 0.005) for High Frequency applicationsNon-PTFE Formulation meets standard lead-free process requirements, while maintaining low-halogen content per current industry standardsImproved thermal robustness cover competing low-loss thermoset materials for better device reliability and performance consistency over timeLow Thermal Expansion and High Glass Transition Temperature minimizes potential for PTH failures and improves operating reliabilityLow moisture absorption for improved processing and consistent performanceDecomposition temperature > 350°C is ideally suited for lead-free solder processingLow TCEr (temperature coefficient of the dielectric) minimizes electrical phase variation with temperatureCertified to UL flammability requirements of UL-94 V0Typical Applications:High-Speed Digital backplanes and server boardsRF Power Amplifier motherboardsSatellite receivers, LNB converters, and other Wireless devicesSemiconductor burn-in-boards and other high speed, high reliability applicationsThis data represents typical values for the production material and should not be used as material specifications.Information provided by ARLON Silicone Technologies Division.