Thermal Properties | Metric | English | Comments |
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CTE, linear | 19.0 µm/m-°C @Temperature -55.0 - 288 °C |
10.6 µin/in-°F @Temperature -67.0 - 550 °F |
X-, Y-Direction; ASTM D3386 |
Rogers Corporation RT/duroid® 6035HTC Ceramic Filled PTFE Composite, High Power RF and Microwave Features & Benefits:High thermal conductivity - Improved dielectric heat dissipation, enabling lower operating temperatures for high power applicationsLow loss tangent - Excellent high frequency per.. |
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CTE, linear | 19.0 µm/m-°C @Thickness 0.102 mm, Temperature 0.000 - 150 °C |
10.6 µin/in-°F @Thickness 0.00400 in, Temperature 32.0 - 302 °F |
X-Direction; IPC-TM-650 2.1.41 |
Rogers Corporation Syron™ 7100 Thermoplastic Circuit Material SYRON™ 7100 thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. SYRON 7100 is thermally stable, with a .. |
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CTE, linear | 19.0 µm/m-°C @Temperature 0.000 - 140 °C |
10.6 µin/in-°F @Temperature 32.0 - 284 °F |
X-, Y-Direction; ASTM D3386 |
Rogers Corporation TMM® TMM101 Ceramic Thermoset Polymer Composite TMM® Thermoset microwave materials are ceramic thermoset polymer composites designed for high plate-thru-hole reliability stripline and microstrip applications. The electrical and mechanical prope.. |
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CTE, linear | 19.0 µm/m-°C @Temperature 0.000 - 150 °C |
10.6 µin/in-°F @Temperature 32.0 - 302 °F |
X-Direction; IPC-TM-650 2.1.41 |
Rogers Corporation XT/duroid™ 8100 0.004" Woven Glass Reinforced Thermoplastic Circuit Material XT/duroid™ 8100 woven glass reinforced thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. XT/duroid 81.. |
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CTE, linear | 19.0 µm/m-°C @Temperature -55.0 - 280 °C |
10.6 µin/in-°F @Temperature -67.0 - 536 °F |
X Direction; IPC-TM-650 2.4.41 |
Rogers Corporation RO4450F Prepreg Prepreg is commonly used to inexpensively form less critical signal layers in antenna designs. A high post-cure Tg makes RO4400 series prepreg an excellent choice for multi-layers requiring sequent.. |
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CTE, linear | 19.0 µm/m-°C @Temperature -50.0 - 50.0 °C |
10.6 µin/in-°F @Temperature -58.0 - 122 °F |
Axial; ASTM E831 |
Solvay Specialty Polymers Ryton® R-7-120NA Polyphenylene Sulfide Compound
(Unverified Data**) Natural Color Polyphenylene Sulfide CompoundRyton® R-7-120NA is an advanced glass/mineral filled polyphenylene sulfide compound developed to provide good weldline strength and low maintenance moldi.. |
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CTE, linear | 19.0 µm/m-°C @Temperature -50.0 - 50.0 °C |
10.6 µin/in-°F @Temperature -58.0 - 122 °F |
Axial; ASTM E831 |
Solvay Specialty Polymers Ryton® R-7-120BL Polyphenylene Sulfide Compound
(Unverified Data**) Black Polyphenylene Sulfide CompoundRyton® R-7-120BL is an advanced glass/mineral filled polyphenylene sulfide compound developed to provide good weldline strength and low maintenance molding using.. |
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CTE, linear | 19.0 µm/m-°C @Temperature 20.0 - 500 °C |
10.6 µin/in-°F @Temperature 68.0 - 932 °F |
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Industeel CLC 17.12.2 Ti Titanium Stabilized 18Cr-11Ni-2Mo Austenitic Stainless Steel CLC 17-12-2Ti is a Titanium stabilized austenitic stainless steel. 2% Molybdenum bearing ensures better corrosion resistance than CLC 18-9 L grade, particularly regarding to uniform and localized co.. |
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CTE, linear | 19.0 µm/m-°C @Temperature -40.0 - 100 °C |
10.6 µin/in-°F @Temperature -40.0 - 212 °F |
Alpha 1; TMA |
Tra-Con Tra-Bond 526W01 Microelectronics Grade Encapsulant TRA-BOND 526W01 is a one component micro-electronics grade controlled flow encapsulant designed to protect wire bonds and bare die. TRA-BOND 526W01 has a low coefficient of thermal expansion and low.. |
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CTE, linear | 19.1 µm/m-°C @Temperature 0.000 - 649 °C |
10.6 µin/in-°F @Temperature 32.0 - 1200 °F |
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Crucible Steel 347 Chromium-Nickel Steel Crucible 347 is a non-hardenable austenitic chromium-nickel steel which are particularly adaptable for use at temperatures between 800 and 1650°F. This grade is non-magnetic in the annealed conditi.. |
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CTE, linear | 19.1 µm/m-°C @Temperature 0.000 - 649 °C |
10.6 µin/in-°F @Temperature 32.0 - 1200 °F |
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Crucible Steel 348 Chromium-Nickel Steel Crucible 348 is a non-hardenable austenitic chromium-nickel steel which are particularly adaptable for use at temperatures between 800 and 1650°F. This grade is non-magnetic in the annealed conditi.. |
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CTE, linear | 19.0 µm/m-°C @Temperature 20.0 - 50.0 °C |
10.6 µin/in-°F @Temperature 68.0 - 122 °F |
MD |
DuPont Teijin Films Melinex® 377 Polyester Film, 142 Gauge Melinex® 377 is a translucent matte film having a medium surface gloss which is suitable for creating woodgrain and muted metallic effects.Typical Applications: Melinex® is suitable for use in sta.. |
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CTE, linear | 19.0 µm/m-°C @Temperature 20.0 - 50.0 °C |
10.6 µin/in-°F @Temperature 68.0 - 122 °F |
MD |
DuPont Teijin Films Melinex® 377 Polyester Film, 48 Gauge Melinex® 377 is a translucent matte film having a medium surface gloss which is suitable for creating woodgrain and muted metallic effects.Typical Applications: Melinex® is suitable for use in sta.. |
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CTE, linear | 19.0 µm/m-°C @Temperature 20.0 - 50.0 °C |
10.6 µin/in-°F @Temperature 68.0 - 122 °F |
MD |
DuPont Teijin Films Melinex® 377 Polyester Film, 500 Gauge Melinex® 377 is a translucent matte film having a medium surface gloss which is suitable for creating woodgrain and muted metallic effects.Typical Applications: Melinex® is suitable for use in sta.. |
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CTE, linear | 19.0 µm/m-°C @Temperature 20.0 - 50.0 °C |
10.6 µin/in-°F @Temperature 68.0 - 122 °F |
MD |
DuPont Teijin Films Melinex® 377 Polyester Film, 92 Gauge Melinex® 377 is a translucent matte film having a medium surface gloss which is suitable for creating woodgrain and muted metallic effects.Typical Applications: Melinex® is suitable for use in sta.. |
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CTE, linear | 19.0 µm/m-°C @Temperature -30.0 - 23.0 °C |
10.6 µin/in-°F @Temperature -22.0 - 73.4 °F |
transverse; ASTM E831 |
Bond Laminates TEPEX® dynalite 102-RG600(x)/47% Roving Glass – PA 6 Consolidated Composite Laminate Within the TEPEX® composite laminate, Polyamide 6 is a resin known for its toughness, stiffness, abrasion resistance, heat and chemical resistances. Roving E-Glass fibers have an excellent impact .. |
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CTE, linear | 19.1 µm/m-°C @Temperature 200 °C |
10.6 µin/in-°F @Temperature 392 °F |
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AK Steel 13-4 SR® Ferritic Stainless Steel AK Steel 13-4 SR Stainless Steel is a ductile weldable ferritic with 13% Cr and 3.75% Al. The high aluminum content results in a base alloy with high electrical resistivity. It is intended for use w.. |
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CTE, linear | 19.0 µm/m-°C @Temperature 0.000 - 100 °C |
10.6 µin/in-°F @Temperature 32.0 - 212 °F |
y direction; IPC TM-650 2.4.24 |
Arlon CuClad 250 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate CuClad 250 uses a higher fiberglass/PTFE ratio to provide mechanical properties approaching those of conventional substrates. Better dimensional stability and lower thermal expansion in all directi.. |
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CTE, linear | 19.0 µm/m-°C @Temperature 20.0 - 500 °C |
10.6 µin/in-°F @Temperature 68.0 - 932 °F |
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Industeel URANUS® S1 4 % Si, Austenitic Stainless Steel Resistant to Nitric Acid Solutions Description: Research carried out in about the last fifteen years in CREUSOT LOIRE INDUSTRIE laboratories shows that a strong addition of silicon to austenitic stainless steels of the 18/10 type has.. |