Polymer Property : CTE, linear = 16.1 µin/in-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	29.0 µm/m-°C @Temperature <=150 °C	16.1 µin/in-°F @Temperature <=302 °F	ISO E 831
Wolf Kunststoff ZEDEX® ZX-750V5KF 055 Polymer Alloy. Fiber Reinforced Main Characteristics: Stiff; High elongation and yield stress; Low thermal expansion; Impact resistantApplications: Textile Machinery; Compressors; Hinges; Handling; Machine Tools; Automitve Technol..
CTE, linear	29.0 µm/m-°C @Temperature 0.000 - 100 °C	16.1 µin/in-°F @Temperature 32.0 - 212 °F	x direction; IPC TM-650 2.4.24
Arlon CuClad 217 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate CuClad 217 uses a low fiberglass/PTFE ratio to provide the lowest dielectric constant and dissipation factor available in fiberglass reinforced PTFE based laminates. Together, these properties offe..
CTE, linear	29.0 µm/m-°C @Temperature 0.000 - 100 °C	16.1 µin/in-°F @Temperature 32.0 - 212 °F	y direction; IPC TM-650 2.4.24
Arlon DiClad 870 PTFE/Woven Fiberglass Laminate Extremely Low Loss TangentExcellent Dimensional StabilityProduct Performance UniformityBenefits:Electrical Properties are highly uniform across frequencyConsistent Mechanical PerformanceExcellent Ch..
CTE, linear	29.0 µm/m-°C @Temperature -50.0 - 30.0 °C	16.1 µin/in-°F @Temperature -58.0 - 86.0 °F
3M Scotch-Weld™ DP-100NS Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP-100NS is a two-part adhesives offering fast cure and machinability.Information provided by 3M
CTE, linear	29.0 µm/m-°C @Temperature 0.000 - 120 °C	16.1 µin/in-°F @Temperature 32.0 - 248 °F	100 x 15 x 3 mm sample; AZDEL Test
Azdel Plus C401B02N 40% Chopped Fiber Mat / PP Resin Matrix AZDEL® C401B02N is a chopped fiber material based on random oriented long chopped glass fiber mat (paper making process). This polypropylene composite material features high flow properties and a ..
CTE, linear	29.0 µm/m-°C @Temperature 40.0 - 125 °C	16.1 µin/in-°F @Temperature 104 - 257 °F	As Molded; ASTM E831
Vyncolit INSUL-PLATE™ X-28057-2HT Hole-Fill Powder For Printed Circuit Boards Vyncolit INSUL-PLATE™ Hole-Fill material delivers true reliability and superior performance. This material, in powder form, is specifically suited for Hole-Fill use in glass epoxy, multi-layer and ..
CTE, linear	29.0 µm/m-°C @Temperature -40.0 - 40.0 °C	16.1 µin/in-°F @Temperature -40.0 - 104 °F	ISO 11359-2
LNP Verton™ UF-700-12 Polyphthalamide, Long Glass Fiber Filled (discontinued **) LNP™ Verton™ UF-700-12 HS EXP is a compound based on Polyphthalamide resin containing Long Glass Fiber. Added features of this material include: Heat Stabilized.Information provided by LNPThis dat..