Polymer Property : CTE, linear = 38.9 µin/in-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	70.0 - 115 µm/m-°C @Temperature 25.0 - 100 °C	38.9 - 63.9 µin/in-°F @Temperature 77.0 - 212 °F	ASTM D696
Polikim EFALON® C-25 PTFE, 25% Glass Filled C15 and C25 have less thermal expansion, higher wear resistance and less deformation under load compared to virgin Efalon® (PTFE). Applications: Seals, Seal rings, gaskets, valve sets, piston rings..
CTE, linear	70.0 µm/m-°C @Temperature 50.0 - 250 °C	38.9 µin/in-°F @Temperature 122 - 482 °F	Z-Axis, Alpha 1; IPC-TM-650.2.4.41
Park Electrochemical Nelco® N8000Q Cyanate Ester Epoxy Laminate and Prepreg The Nelco N8000 is a high-Tg cyanate ester laminate and prepreg system that provides superior performance and product integrity and is ideal for board designs with higher layer counts, finer lines a..
CTE, linear	70.0 µm/m-°C @Temperature 200 - 300 °C	38.9 µin/in-°F @Temperature 392 - 572 °F	ASTM TMA
PBI Performance Products Celazole® TU-60 Unreinforced Melt Processable Polybenzimidazole Celazole® polybenzimidazole (PBI) resin is a unique and highly stable linear hetrocyclic polymer. PBI is characterized by high strength; excellent thermal stability, and broad chemical resistance. ..
CTE, linear	70.0 µm/m-°C @Temperature >=143 °C	38.9 µin/in-°F @Temperature >=289 °F	Average above Tg; ISO 11359
Victrex® PEEK 90GL60 Polyetheretherketone, 60% Glass Fibre Reinforced Product Description:High performance thermoplastic material, 60% glass fibre reinforced Polyetheretherketone (PEEK), semi crystalline, granules for injection moulding, standard flow, FDA food contac..
CTE, linear	70.0 µm/m-°C @Temperature 50.0 - 175 °C	38.9 µin/in-°F @Temperature 122 - 347 °F	Z-Axis Alpha 1; IPC-TM-650.2.4.41
Park Electrochemical Nelco® N4000-6 FC Multifunctional Epoxy Laminate and Prepreg The Nelco® N4000-6 FC is a high-Tg epoxy laminate and prepreg system that provides a wide range of performance versatility and ease of processing for demanding high-layer count applications.Key Fea..