Polymer Property : Decomposition Temperature = 390 °C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Decomposition Temperature	390 °C	734 °F	TGA; ASTM D3850
Rogers Corporation RO4350B Glass-Reinforced Hydrocarbon and Ceramic Laminate with Thin Film Resistor Foil RO4000® Series High Frequency Circuit Materials are glass-reinforced hydrocarbon and ceramic (not PTFE) laminates with TICER™ TCR® Thin Film Resistor Foils. These laminates are designed for perf..
Decomposition Temperature	390 °C	734 °F	TGA; ASTM D3850
Rogers Corporation RO4450B Prepreg Prepreg is commonly used to inexpensively form less critical signal layers in antenna designs. A high post-cure Tg makes RO4400 series prepreg an excellent choice for multi-layers requiring sequent..
Decomposition Temperature	390 °C	734 °F	TGA; ASTM D3850
Rogers Corporation RO4835 Hydrocarbon Ceramic Laminate, Improved Oxidation Resistance Features and Benefits:Significantly improved oxidation resistance compared to typical thermoset microwave materialsDesigned for performance sensitive, high volume applicationsLow loss - Excellent el..
Decomposition Temperature	390 °C	734 °F	TGA; ASTM D3850
Rogers Corporation RO4450F Prepreg Prepreg is commonly used to inexpensively form less critical signal layers in antenna designs. A high post-cure Tg makes RO4400 series prepreg an excellent choice for multi-layers requiring sequent..
Decomposition Temperature	390 °C	734 °F	5% weight loss; TGA; IPC-TM-650.2.4.24.6
Park Electrochemical Nelco® N7000-2 V0 Toughened Polyimide Laminate and Prepreg The Nelco N7000-2 V0 series is a next-generation high-Tg polyimide using a toughened resin chemistry to achieve a UL 94-V0 designation. This advanced material is designed for use in a wide variety o..
Decomposition Temperature	>= 390 Â°C	>= 734 Â°F
Shandong Dongyue Shenzhou New Material Co DS201 Polyvinylidene Fluoride Powder Conformable with: Q/DYS 014-2007Polyvinylidene fluoride (PVDF) powder (DS201) PVDF is the homopolymer of vinylidene fluoride, which is excellent chemical corrosion-resistant, high temperature resist..
Decomposition Temperature	390 °C	734 °F	Degradation Temperature
Epoxy Technology EPO-TEK® 301-1 Optical Grade Epoxy Material Description: A two component, room temperature curing, optical grade epoxy, designed for optics, medical, and opto-electronic packaging of semiconductor devices, components, and electronics..
Decomposition Temperature	390 °C	734 °F	Degradation Temperature; TGA
Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c..
Decomposition Temperature	390 °C	734 °F	Initial; IPC TM-650 2.3.41
Arlon MULTICLAD™ HF Halogen-Free Low-Loss Laminate and Prepreg System MULTICLAD™ HF represents the next generation low-loss thermoset and prepreg system for high-speed and high-frequency printed circuit boards. This technology combines a low-loss, high reliability t..