Thermal Properties | Metric | English | Comments |
---|---|---|---|
Decomposition Temperature | 432 °C | 810 °F | 5 percent; IPC TM-650 2.3.41 |
Arlon MULTICLAD™ HF Halogen-Free Low-Loss Laminate and Prepreg System MULTICLAD™ HF represents the next generation low-loss thermoset and prepreg system for high-speed and high-frequency printed circuit boards. This technology combines a low-loss, high reliability t.. |