Polymer Property : Decomposition Temperature = 901 °F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Decomposition Temperature	483 °C	901 °F	TGA, Degradation Temp, uncured
Atom Adhesives AA-BOND G298 Epoxy Adhesive AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Appearance: Resin: Brown, Hardener: Dark Bro..