Polymer Property : CTE, linear = 118 µin/in-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	212 µm/m-°C	118 µin/in-°F	Above Tg
Epoxy Technology EPO-TEK® EE165-3 Silver Filled Epoxy A two component, silver-filled, electrically conductive epoxy made for bonding of SMDs, and general solder replacement at the PCB level and circuit assembly. It was designed to be low modulus and f..
CTE, linear	212 µm/m-°C	118 µin/in-°F	Above Tg
Tra-Con Tra-Bond 516H01 Low Viscosity Room Temperature Cure Adhesive TRA-BOND 516H01 is a room temperature curing, low viscosity adhesive formulated for terminating ALL TYPES of fiber optic connectors, including Pre-Mixed and Frozen applications. It has also been use..