Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 450 µm/m-°C @Temperature 20.0 °C |
250 µin/in-°F @Temperature 68.0 °F |
DIN 53752; ASTM D696 |
Kolon SPELLOY® KB133G15 PC + PBT Alloy Resin
(discontinued **) SPELLOY® is a new technology of thermoplastic Polymer alloys developed to provide unique combination of excellent mechanical properties.High impact resistance (at low temperature), good dimensional.. |
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CTE, linear | 450 µm/m-°C | 250 µin/in-°F | Alpha 2; TMA |
Lord Adhesives Thermosetâ„¢ MS-330 Silicone Board Level Encapsulant LORD Thermosetâ„¢ MS-330 encapsulant is a one component silicone specifically designed for use on high-frequency devices including Bluetooth applications. This silicone encapsulant offers excelle.. |