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Lord Adhesives Thermosetâ„¢ MS-330 Silicone Board Level Encapsulant

Category Polymer , Thermoset , Silicone , Silicone, RTV, Encapsulation Grade
Manufacturer Lord Adhesives
Trade Name Thermoset™
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Lord Adhesives Thermosetâ„¢ MS-330 Silicone Board Level Encapsulant.pdf
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Material Notes:
LORD Thermosetâ„¢ MS-330 encapsulant is a one component silicone specifically designed for use on high-frequency devices including Bluetooth applications. This silicone encapsulant offers excellent electrical insulation properties ideal for coating and protecting electronic devices on polymeric and ceramic substrates.All information provided by Lord.
Physical Properties Metric English Comments
Specific Gravity 1.04 g/cc
1.04 g/cc
Brookfield Viscosity 15000 - 23000 cP

@Temperature 25.0 °C
15000 - 23000 cP

@Temperature 77.0 °F
Spindle CP52 @ 10rpm
Mechanical Properties Metric English Comments
Hardness, Shore A 30 - 35
30 - 35
Modulus of Elasticity 0.0100 GPa
1.45 ksi
DMA
Thermal Properties Metric English Comments
CTE, linear 450 µm/m-°C
250 µin/in-°F
Alpha 2; TMA
Glass Transition Temp, Tg -40.0 °C
-40.0 °F
TMA
Electrical Properties Metric English Comments
Volume Resistivity 1.20e+16 ohm-cm

@Temperature 25.0 °C
1.20e+16 ohm-cm

@Temperature 77.0 °F
Dielectric Constant 2.8

@Frequency 1.00e+6 Hz
2.8

@Frequency 1.00e+6 Hz
Dissipation Factor 0.0020

@Frequency 1.00e+6 Hz
0.0020

@Frequency 1.00e+6 Hz
Processing Properties Metric English Comments
Cure Time 30.0 - 60.0 min

@Temperature 125 °C
0.500 - 1.00 hour

@Temperature 257 °F
Pot Life 10080 min

@Temperature 25.0 °C
10080 min

@Temperature 77.0 °F
Gel Time 15.0 min

@Temperature 150 °C
15.0 min

@Temperature 302 °F
Shelf Life 6.00 Month

@Temperature -30.0 °C
6.00 Month

@Temperature -22.0 °F
Descriptive Properties Value Comments
Appearance Black
Consistency Liquid
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