Polymer Property : CTE, linear = 43.9 µin/in-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	79.0 µm/m-°C @Temperature 20.0 °C	43.9 µin/in-°F @Temperature 68.0 °F	ASTM D696
Ineos ABS Centrex® 401 AES Extrusion (discontinued **) Properties tested in transverse direction (worst case) on 125-mil (3.2 mm) extruded sheets specimens with
CTE, linear	79.0 µm/m-°C @Temperature 20.0 °C	43.9 µin/in-°F @Temperature 68.0 °F	ASTM D696
Covestro Baydur® 726 IBS Polyurethane Structural Foam RIM, Density 40 pcf, MDI-based 2-Component Liquid System 0.25 in. thickness. IBS = Interactive Blowing System RIM = Reaction Injection MoldingInformation provided by Bayer Corporation, Polyurethanes DivisionAs of 1 September 2015, Bayer MaterialScience ..
CTE, linear	79.0 µm/m-°C @Temperature 20.0 °C	43.9 µin/in-°F @Temperature 68.0 °F	ASTM D696
Covestro Baydur® 730 IBS Polyurethane Structural Foam RIM, Density 35 pcf, MDI-based 2-Component Liquid System 0.25 in. thickness. IBS = Interactive Blowing System RIM = Reaction Injection MoldingInformation provided by Bayer Corporation, Polyurethanes DivisionAs of 1 September 2015, Bayer MaterialScience ..
CTE, linear	79.0 µm/m-°C	43.9 µin/in-°F	Above Tg
Epoxy Technology EPO-TEK® H55 Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology
CTE, linear	79.0 µm/m-°C	43.9 µin/in-°F	ASTM E 831
Arlon Thermabond® T-20 NP (99770W008) 0.008" (0.203 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier Description: 8 mil Primerless Thermabond®. T-20 NP. Thermally conductive, electrically insulating electronic adhesive. Bonds with primer.Design/Construction: Liner: FEP Product: Uncured Silicone Ru..
CTE, linear	79.0 µm/m-°C	43.9 µin/in-°F	ASTM E 831
Arlon Thermabond® T-20 NP (99770W015) 0.015" (0.381 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier Description: 15 mil Primerless Thermabond®. T-20 NP. Thermally conductive, electrically insulating electronic adhesive. Bonds with primer.Design/Construction:Liner: FEPProduct: Uncured Silicone Rub..
CTE, linear	79.0 µm/m-°C @Temperature 0.000 - 40.0 °C	43.9 µin/in-°F @Temperature 32.0 - 104 °F
3M Scotch-Weld™ 183 B/A Green Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive 1838 B/A is a controlled flow product. This epoxy adhesives are two-part, room temperature curing structural adhesives with high shear strengths and excellent envir..