Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 0.0900 W/m-K | 0.625 BTU-in/hr-ft²-°F | ASTM C158 |
Rogers Corporation Bisco™ HT-800 Cellular Silicone Foam Medium grade silicon sponge. UL recognized for flame retardance and gasketing.Applications: HID (High Intensity Discharge) lighting fixture gaskets, Battery cushion in hand-held electronic products.. |
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Thermal Conductivity | 0.0900 W/m-K | 0.625 BTU-in/hr-ft²-°F | ASTM C518-98 |
Rogers Corporation Poron® 4701-50 Supported Urethane Foam, Firm, PET Supported Firm material used for managing high energy impact with gasketing needs. Standard available thickness range from 0.012" to 0.500" (0.30 mm to 12.7 mm).Features and Benefits of PORON Products: Exce.. |
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Thermal Conductivity | 0.0900 W/m-K | 0.625 BTU-in/hr-ft²-°F | |
Pyrotek F-24 Dense Machinable Board F-24 is a high temperature resin material that is reinforced with fiberglass. Abrasion resistant, it is used for hot glass handling applications.ApplicationsDonut rollers for glass Guide rails Wear.. |
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Thermal Conductivity | 0.0900 W/m-K | 0.625 BTU-in/hr-ft²-°F | |
Pyrotek F-51 Dense Machinable Board F-51 is a high temperature resin base, supplemented with fiberglass and graphite to provide extra strength and lubricity. F-51 is abrasion resistant and suitable for hot glass handling applications.. |
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Thermal Conductivity | 0.0900 W/m-K | 0.625 BTU-in/hr-ft²-°F | ASTM C158 |
Rogers Corporation Poron® 4701-50-20 Cellular Urethane Foam Standard color is black (04); others are available. Passes flammability tests UL HBF (File E20305), MVSS 302, and CSA Component Acceptance HBF (File 188149). Passes fogging test SAE-J 1736 for 3 h.. |