Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 0.258 W/m-K | 1.79 BTU-in/hr-ft²-°F | |
Perstorp Compounds Aminel FX Melamine Organically reinforced melamine material with excellent flow properties and high flexibility suitable for applications involving high complexity and surface demands.Information provided by Perstorp .. |
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Thermal Conductivity | 0.258 W/m-K | 1.79 BTU-in/hr-ft²-°F | |
Perstorp Compounds Aminel GF Melamine Fiberglass-reinforced melamine material with high dimensional stability, excellent injection properties and high thermal stabilityInformation provided by Perstorp Compounds Inc. |
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Thermal Conductivity | 0.258 W/m-K @Temperature 100 °C |
1.79 BTU-in/hr-ft²-°F @Temperature 212 °F |
ASTM E1225 |
Arlon CuClad 233 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate CuClad 233 uses a medium fiberglass/PTFE ratio to balance lower dielectric constant and improved dissipation factor without sacrificing mechanical properties.Cross Plied Woven Fiberglass, alternatin.. |