Polymer Property : Thermal Conductivity = 0.429 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.429 W/m-K	2.98 BTU-in/hr-ft²-°F	ASTM F433
Quadrant EPP Ketron® CM GF30 Compression Molded, 30% Glass Reinforces Polyethererther Ketone(ASTM Product Data Sheet)
Thermal Conductivity	0.429 W/m-K	2.98 BTU-in/hr-ft²-°F	ASTM F433
Quadrant EPP Ketron® GF30 PEEK, Extruded 30% Glass-Reinforced Polyetherether Ketone (ASTM Product Data Sheet)
Thermal Conductivity	0.429 W/m-K	2.98 BTU-in/hr-ft²-°F	ASTM C177
Quantum PEEK 30% Glass Fiber Filled Information provided by Quantum Advanced Engineering Plastics
Thermal Conductivity	0.429 W/m-K	2.98 BTU-in/hr-ft²-°F
Quadrant EPP Ketron® GF30 LSG PEEK, Extruded 30% Glass-Reinforced Polyetherether Ketone (ASTM Product Data Sheet)
Thermal Conductivity	0.429 W/m-K	2.98 BTU-in/hr-ft²-°F
3M Scotch-Weld™ 2214 Hi-Temp New Formula Epoxy Adhesive 3M™ Scotch-Weld™ Adhesive 2214 Hi-Temp Formula is an aluminum filled, deaerated products fro use where higher strengths are required between 82-177°C. One part 250°F (121°C) curing 100% solids,..
Thermal Conductivity	0.429 W/m-K	2.98 BTU-in/hr-ft²-°F
3M Scotch-Weld™ EC-2086 Structural Adhesive 3M™ Scotch-Weld™ Structural Adhesive EC-2086 is a one-part, 100% solids thermosetting liquid adhesives.Information provided by 3M