Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 0.860 W/m-K @Temperature 80.0 °C |
5.97 BTU-in/hr-ft²-°F @Temperature 176 °F |
ASTM C518 |
Rogers Corporation RT/duroid® 6010.2LM Ceramic-PTFE Composite Microwave Laminate Features:High dielectric constant for circuit size reductionLow loss - Ideal for operating at X-band or belowLow Z-axis expansion. Provides reliable plated through holes in multi-layer boardsTight .. |
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Thermal Conductivity | 0.860 W/m-K | 5.97 BTU-in/hr-ft²-°F | through-plane, ø80*3mm discs; ISO 22007-2 |
SABIC Innovative Plastics LNP KONDUIT PX09322 PA 6 (Asia Pacific) White colored thermally conductive mineral filled PA6 FR compound |
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Thermal Conductivity | 0.860 W/m-K | 5.97 BTU-in/hr-ft²-°F | |
Schott N-LAK10 Glass Information Provided by SCHOTT North America, Inc. |
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Thermal Conductivity | 0.860 W/m-K | 5.97 BTU-in/hr-ft²-°F | |
Trelleborg Emerson & Cuming Stycast® 906-1 One-Component Epoxy High Service Temp Encapsulant Features and Typical ApplicationsAbility to withstand high temperatures, thermal shock, and chemical exposure. These products are designed for heat generating electronic devices which operate in har.. |