Polymer Property : Thermal Conductivity = 0.980 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.980 W/m-K	6.80 BTU-in/hr-ft²-°F	through-plane, ø80*3mm discs; ISO 22007-2
SABIC Innovative Plastics LNP KONDUIT PX11313 PA 6 (Asia Pacific) Thermally conductive mineral filled PA6 FR compounding
Thermal Conductivity	0.980 W/m-K	6.80 BTU-in/hr-ftÂ²-Â°F	ASTM C177
Techmer ES HiFillÂ® PA4/6 0206 Availability: North AmericaForms: PelletsFeatures: High Specific Gravity and Thermally ConductiveInformation provided by TP Composites, Inc.
Thermal Conductivity	0.980 W/m-K	6.80 BTU-in/hr-ft²-°F
Epoxy Technology EPO-TEK® EE149-6 Epoxy Material Description: A single component, silver-filled, B-stageable epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing.Information Provi..
Thermal Conductivity	0.980 W/m-K	6.80 BTU-in/hr-ft²-°F	through-plane, ø80*3mm discs; ISO 22007-2
SABIC Innovative Plastics LNP KONDUIT PX11313 PA 6 (Europe-Africa-Middle East) Thermally conductive mineral and glass fiber filled PA6, FR, compliant with ECO protocols, non-brominated, non-chlorinated