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Epoxy Technology EPO-TEK® EE149-6 Epoxy
| Category | Polymer , Thermoset , Epoxy |
| Manufacturer | Epoxy Technology |
| Trade Name | EPO-TEK® |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Epoxy Technology EPO-TEK® EE149-6 Epoxy.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Material Description: A single component, silver-filled, B-stageable epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing.Information Provided by Epoxy Technology
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 3.27 g/cc | 3.27 g/cc | |
| Particle Size | <= 20 µm | <= 20 µm | |
| Viscosity | 2000 - 4000 cP @Temperature 23.0 °C |
2000 - 4000 cP @Temperature 73.4 °F |
100 rpm |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 74 | 74 | |
| Tensile Modulus | 3.77 GPa | 547 ksi | Storage |
| Shear Strength | 3.78 MPa | 548 psi | Lap |
| >= 35.2 MPa | >= 5100 psi | Die |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 34.0 µm/m-°C | 18.9 µin/in-°F | Below Tg |
| 113 µm/m-°C | 62.8 µin/in-°F | Above Tg | |
| Thermal Conductivity | 0.980 W/m-K | 6.80 BTU-in/hr-ft²-°F | |
| Maximum Service Temperature, Air | 200 °C | 392 °F | Continuous |
| 300 °C | 572 °F | Intermittent | |
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| -55.0 °C | -67.0 °F | Intermittent | |
| Glass Transition Temp, Tg | >= 130 °C | >= 266 °F | Dynamic Cure 20—300°C /ISO 25 Min; Ramp -10—300°C @ 20°C/Min |
| Decomposition Temperature | 380 °C | 716 °F | Degradation Temperature |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | <= 0.00050 ohm-cm | <= 0.00050 ohm-cm |
| Chemical Properties | Metric | English | Comments |
|---|---|---|---|
| Ionic Impurities - Na (Sodium) | 8.0 ppm | 8.0 ppm | |
| Ionic Impurities - K (Potassium) | 5.0 ppm | 5.0 ppm | |
| Ionic Impurities - Cl (Chloride) | 4.0 ppm | 4.0 ppm |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 10.0 min @Temperature 70.0 °C |
0.167 hour @Temperature 158 °F |
|
| Pot Life | 36000 min | 36000 min | |
| Shelf Life | 6.00 Month @Temperature -40.0 °C |
6.00 Month @Temperature -40.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | Silver | |
| Consistency | Smooth paste | |
| Ionic Impurities NH4 | 10 ppm | |
| Number of Components | Single | |
| Thixotropic Index | 4.7 | |
| Weight Loss | 0.05% | 250°C |
| 0.16% | 300°C |
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