Polymer Property : Thermal Conductivity = 1.07 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English
Thermal Conductivity	1.07 W/m-K	7.43 BTU-in/hr-ft²-°F
Resinlab® EP1330 Heat Cure Epoxy Polymer System Resinlab™ EP1330 and EP1330LV are one part heat cure epoxy polymer systems. They can also be used as a small mass potting or staking compounds, or a dam adhesive in and “dam and fill” application..
Thermal Conductivity	1.07 W/m-K	7.43 BTU-in/hr-ft²-°F
Resinlab® EP1330LV Heat Cure Epoxy Polymer System Resinlab™ EP1330 and EP1330LV are one part heat cure epoxy polymer systems. They can also be used as a small mass potting or staking compounds, or a dam adhesive in and “dam and fill” application..