Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 2.50 W/m-K | 17.4 BTU-in/hr-ft²-°F | ASTM C177 |
PolyOne Therma-Tech™ LC-5000C TC LCP
(discontinued **) Therma-Tech™ Thermal Management Compounds have been engineered to combine the heat transfer and cooling capabilities of metals with the design freedom, weight reduction and cost advantages of therm.. |
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Thermal Conductivity | 2.50 W/m-K | 17.4 BTU-in/hr-ft²-°F | ASTM C177 |
LG Chemical LUCON PN9009 PPS+MF Injection Molding Grade, PPS+MF, High Thermal Conductivity, Chemical Resistance, High Heat ResistanceApplication: Electrical or Electronic Parts (Heat sink, LED etc.) Motor HousingCAS No. 25212-74-2.. |
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Thermal Conductivity | 2.50 W/m-K | 17.4 BTU-in/hr-ft²-°F | |
Shin-Etsu Silicones KE-1867 Silicone, RTV Adhesive/Sealant Information Provided by Shin-Etsu Silicones of America, Inc. |
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Thermal Conductivity | 2.50 W/m-K | 17.4 BTU-in/hr-ft²-°F | DIN EN 821-2 / ASTM-C408 |
CeramTec Frequenta® Steatite Steatites used in place of aluminas are a cost-effective way to meet performance requirements. They are easier to form and fire at lower temperatures. Frequenta® has low dielectric loss, but has be.. |
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Thermal Conductivity | 2.50 W/m-K | 17.4 BTU-in/hr-ft²-°F | DIN EN 821-2 |
CeramTec MZ 111 HIP Zirconia, ZrO2-Y2O3 MZ 111 HIP is a yttria-stabilized tetragonal zirconia ceramic. |
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Thermal Conductivity | 2.50 W/m-K | 17.4 BTU-in/hr-ft²-°F | DIN EN 821-2 |
CeramTec MZ 111 Zirconia, ZrO2-Y2O3 MZ 111 is a yttria-stabilized tetragonal zirconia used in dental applications. |
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Thermal Conductivity | 2.50 W/m-K | 17.4 BTU-in/hr-ft²-°F | DIN EN 821-2 |
CeramTec MZ 429 Zirconia, ZrO2-Y2O3 MZ 429 is a yttria-stabilized zirconia ceramic. |
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Thermal Conductivity | 2.50 W/m-K | 17.4 BTU-in/hr-ft²-°F | |
Dow Corning SE 4447 CV KIT Two-part liquid silicone elastomer designed for applications requiring very high thermal conductivity and electrical insulation.Information provided by Dow Corning |
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Thermal Conductivity | 2.50 W/m-K | 17.4 BTU-in/hr-ft²-°F | |
Epoxy Technology EPO-TEK® E2101 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E2101 is a two component, thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications. Advantages & Application .. |
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Thermal Conductivity | 2.50 W/m-K | 17.4 BTU-in/hr-ft²-°F | Based on standard method: Laser Flash |
Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al.. |
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Thermal Conductivity | >= 2.50 W/m-K | >= 17.4 BTU-in/hr-ft²-°F | |
Epoxyset Epoxiohm EO-24 Electrically Conductive Epoxy Adhesive EO-24 is a two components, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is used for thermal management applica.. |
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Thermal Conductivity | 2.50 W/m-K | 17.4 BTU-in/hr-ft²-°F | Based on standard method: Laser Flash |
Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also .. |
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Thermal Conductivity | 2.50 W/m-K | 17.4 BTU-in/hr-ft²-°F | |
Epoxy Technology EPO-TEK® H20E-LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-LV is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a .. |
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Thermal Conductivity | 2.50 W/m-K | 17.4 BTU-in/hr-ft²-°F | Silicone Property; ASTM E 1530 |
Arlon Thermabond® 99730N004 0.004" (0.102 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier Description: Electrically Conductive - Thermabond®. Bonds with primer.Design/Construction: Liner: FEP Product: Uncured Silicone Rubber Carrier: PTFE Coated FiberglassRecommended Primers: Dow Coring.. |
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Thermal Conductivity | 2.50 W/m-K | 17.4 BTU-in/hr-ft²-°F | Silicone Property; ASTM E 1530 |
Arlon Thermabond® 99730N015 0.015" (0.381 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier Description: Electrically Conductive - Thermabond®. Bonds with primer.Design/Construction: Liner: FEP Product: Uncured Silicone Rubber Carrier: PTFE Coated FiberglassRecommended Primers: Dow Coring.. |
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Thermal Conductivity | 2.50 W/m-K | 17.4 BTU-in/hr-ft²-°F | silicone property; ASTM E 1530 |
Arlon Thermabond® 99950N008 Silicone Rubber/Fiberglass Laminate Electrically conductive, Thermabond®. primerless. Liner: 1 mil FEP; Product: uncured silicone rubber; Carrier: 3 mil PTFE coated fiberglass. |
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Thermal Conductivity | 2.50 W/m-K | 17.4 BTU-in/hr-ft²-°F | silicone property; ASTM E 1530 |
Arlon Thermabond® 99950N015 Silicone Rubber/Fiberglass Laminate Electrically conductive, Thermabond®. primerless. Liner: 1 mil FEP; Product: uncured silicone rubber; Carrier: 3 mil PTFE coated fiberglass. |
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Thermal Conductivity | 2.50 W/m-K @Temperature 20.0 - 100 °C |
17.4 BTU-in/hr-ft²-°F @Temperature 68.0 - 212 °F |
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Anderman Ceramics EZY 88 Zirconia, 88%, Fully Yttria-Stabilized Zirconia materials offer high temperature capability as well as excellent performance in areas of high wear and corrosion. Available in many shapes and sizes. |